XCVU3P-L2FFVC1517E

The XCVU3P-L2FFVC1517E is a Virtex® UltraScale+™ field programmable gate array (FPGA) supplied in a 1517-FCBGA package. It combines a high count of programmable logic resources, substantial embedded memory, and a large I/O complement to address designs that require large-scale, reconfigurable logic and dense system integration.

Key platform attributes include 49,260 CLBs, 862,050 logic elements, approximately 130 Mbits of embedded memory, 520 I/O pins, an extended operating temperature range, and RoHS compliance, enabling deployment in systems that require robust on-chip resources and surface-mount packaging.

Key Features

• Core Logic  49,260 CLBs and 862,050 logic elements provide extensive programmable logic capacity for large designs and complex logic implementations.
• Embedded Memory  Approximately 130 Mbits of on-chip RAM (130,355,200 bits) to support buffering, caching, and memory-intensive algorithm implementations.
• I/O  520 general-purpose I/O pins to support wide parallel interfaces, multi-channel connectivity, and high-pin-count boards.
• Power Supply  Specified core voltage supply range of 698 mV to 742 mV for the device core power domain.
• Package & Mounting  1517-FCBGA supplier package (40×40) in a 1517-BBGA/FCBGA case, designed for surface-mount placement on PCBs.
• Temperature & Grade  Extended grade device with an operating temperature range of 0 °C to 110 °C.
• Compliance  RoHS compliant to meet regulatory environmental requirements for lead-free assembly.

Typical Applications

• High-density programmable logic systems  Useful where large numbers of logic elements and CLBs are required to implement complex custom logic and data-paths.
• Memory-intensive designs  Suited to applications that need substantial on-chip RAM for buffering, packet processing, or algorithm workspace.
• High I/O count systems  Ideal for boards and modules that require many parallel interfaces or multi-channel connectivity with up to 520 I/O pins.

Unique Advantages

• Large logic capacity: 862,050 logic elements give designers the headroom to implement complex, high-function-count designs without partitioning across multiple devices.
• Substantial on-chip memory: Approximately 130 Mbits of embedded RAM reduces dependency on external memory for many buffering and storage needs.
• High I/O density: 520 I/O pins support broad peripheral connectivity and high-bandwidth parallel interfaces on a single device.
• Compact FCBGA packaging: 1517-FCBGA (40×40) package enables surface-mount integration for space-constrained board designs.
• Extended operating range: 0 °C to 110 °C grade provides a wider thermal envelope for demanding system environments.
• Regulatory readiness: RoHS compliance supports lead-free assembly processes.

Why Choose XCVU3P-L2FFVC1517E?

The XCVU3P-L2FFVC1517E positions itself as a high-capacity, tightly integrated FPGA option within the Virtex® UltraScale+™ family, offering a combination of large programmable logic resources, substantial embedded memory, and a high I/O count in a compact surface-mount FCBGA package. Its extended temperature range and RoHS compliance make it suitable for demanding board-level designs that require robust on-chip capabilities.

This device is appropriate for engineering teams and procurement needing a single-device solution to consolidate logic, memory, and I/O requirements—reducing external component count and simplifying board-level design while supporting scalable, reconfigurable implementations.

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