XCVU37P-1FSVH2892E

The XCVU37P-1FSVH2892E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 2892-FCBGA (55×55) package. It provides a high-capacity programmable fabric with a large number of logic elements, substantial on-chip memory, and a high I/O count for complex system designs.

With 2,851,800 logic elements and approximately 74.3 Mbits of embedded memory, this device targets designs that require significant logic density, on-chip storage, and extensive external interfacing while operating within an extended temperature range.

Key Features

• Core Architecture Virtex® UltraScale+™ FPGA family device, providing a high-density programmable fabric.
• Logic Capacity 2,851,800 logic elements to implement large-scale digital designs and complex custom logic.
• Embedded Memory Approximately 74.3 Mbits of on-chip RAM to support buffering, lookup tables, and scratchpad storage.
• I/O Density 624 user I/Os to support wide parallel interfaces and multiple external connections.
• Power Supply Range Core voltage supply range of 825 mV to 876 mV to match system power delivery requirements.
• Package & Mounting 2892-BBGA, FCBGA package (supplier device package: 2892-FCBGA, 55×55) in a surface-mount form factor for high-pin-count board designs.
• Temperature & Grade Extended grade with an operating temperature range of 0°C to 100°C for applications within this thermal envelope.
• Regulatory Compliance RoHS compliant to meet common environmental and manufacturability requirements.

Typical Applications

• High-density compute and signal processing — Use the large logic capacity and embedded memory for compute- and data-intensive FPGA implementations.
• Interface aggregation and bridging — Leverage 624 I/Os for consolidating multiple external interfaces and high-pin-count connectivity.
• On-chip buffering and temporary storage — Approximately 74.3 Mbits of embedded RAM supports buffering and local data handling in complex designs.

Unique Advantages

• Extensive logic resources: 2,851,800 logic elements enable implementation of large-scale, deeply pipelined, or parallel architectures without immediate need for external logic.
• Substantial embedded memory: Approximately 74.3 Mbits of on-chip RAM reduces reliance on external memory for many buffering and lookup tasks.
• High I/O capacity: 624 I/Os allow flexible interfacing to sensors, transceivers, and peripheral devices, simplifying board-level routing for multi-interface systems.
• High-pin-count, compact package: 2892-FCBGA (55×55) package delivers dense connectivity in a surface-mount form factor suitable for space-constrained PCBs.
• Controlled power window: Defined core voltage range (825 mV–876 mV) supports precise power delivery designs and predictable core behavior.
• Extended operating grade and RoHS compliance: Extended grade operation (0°C–100°C) and RoHS compliance align the device with common industrial manufacturing and environmental requirements.

Why Choose XCVU37P-1FSVH2892E?

The XCVU37P-1FSVH2892E combines a high-density Virtex® UltraScale+™ programmable fabric with substantial embedded memory and a large I/O complement, making it well suited for complex systems that require on-chip compute, buffering, and extensive external interfacing. Its 2892-FCBGA package delivers high pin count in a surface-mount form factor while operating within a defined core voltage window and an extended temperature range.

Backed by AMD's Virtex® UltraScale+™ family, this device is appropriate for design teams seeking scalable logic capacity, significant on-chip memory resources, and robust I/O availability for advanced FPGA-based implementations.

Request a quote or submit a sales inquiry to evaluate XCVU37P-1FSVH2892E for your next high-density FPGA design project.