XCVU35P-3FSVH2104E

The XCVU35P-3FSVH2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD designed for high-density programmable logic applications. It delivers extensive on-chip resources—large logic capacity, substantial embedded RAM, and a high I/O count—packaged in a 2104-FCBGA (47.5×47.5) surface-mount form factor.

Key Features

• Core Architecture — Virtex® UltraScale+™ FPGA architecture in a high-density device configuration.
• Logic Capacity — 108,960 logic blocks and 1,906,800 logic elements to implement complex custom logic and wide parallel architectures.
• Embedded Memory — Approximately 49.6 Mbits of on-chip RAM (49,597,645 bits) for buffering, state storage, and memory-intensive functions.
• I/O Density — 416 programmable I/O pins to support extensive external connectivity and interface consolidation.
• Package — 2104-FCBGA package case (2104-BBGA, FCBGA) with a 47.5×47.5 mm footprint for dense system integration.
• Power — Specified core supply voltage range from 873 mV to 927 mV to guide power system design.
• Temperature & Grade — Extended grade device rated for operation from 0 °C to 100 °C.
• Mounting & Compliance — Surface mount device; RoHS compliant for environmental regulatory compatibility.

Typical Applications

• High-density programmable logic systems — Implement large-scale custom logic where abundant logic elements and blocks are required.
• I/O-intensive platforms — Use the 416 I/O pins to consolidate multiple external interfaces and peripherals on a single device.
• Memory-centric designs — Leverage approximately 49.6 Mbits of embedded RAM for buffering, packet processing, and lookup tables.
• Compact system integration — The 2104-FCBGA package enables placing high logic capacity into space-constrained board designs.

Unique Advantages

• Large logic and block counts: 108,960 logic blocks and 1,906,800 logic elements provide the capacity to implement complex, parallelized designs without external logic expansion.
• Substantial on-chip memory: Approximately 49.6 Mbits of embedded RAM reduce reliance on external memory for many buffering and state-storage needs.
• High I/O capacity: 416 I/O pins support broad peripheral and interface integration, minimizing additional interface components.
• Predictable power envelope: Defined core voltage range (873 mV–927 mV) assists in designing stable power delivery and thermal profiles.
• Extended-grade operation: 0 °C to 100 °C rating supports deployment in applications requiring an extended commercial temperature range.
• RoHS compliance and surface-mount packaging: Simplifies assembly and regulatory alignment for production programs.

Why Choose XCVU35P-3FSVH2104E?

The XCVU35P-3FSVH2104E is positioned for designs that require high integration of logic, memory, and I/O in a single FPGA package. With nearly two million logic elements, approximately 49.6 Mbits of embedded RAM, and 416 I/O, it supports complex custom implementations and dense system integration while providing a defined electrical and thermal operating window.

This device is suitable for teams and projects focused on consolidating functionality onto a single programmable device, reducing external component count, and achieving scalable logic and memory capacity within a 2104-FCBGA form factor.

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