XCVU35P-L2FSVH2104E

The XCVU35P-L2FSVH2104E is a Virtex® UltraScale+™ field-programmable gate array (FPGA) IC from AMD. It offers a large on-chip resource set for complex programmable logic implementations.

Device characteristics include approximately 1,906,800 logic elements, approximately 49.6 Mbits of embedded memory, and 416 I/O, packaged in a 2104-FCBGA format. These documented specifications emphasize substantial logic capacity, memory resources, and I/O density for applications that require significant on-chip integration.

Key Features

• Configurable logic — The device provides 1,906,800 logic elements to implement large-scale programmable logic designs; the specification also lists 108,960 logic blocks.
• On-chip memory — Approximately 49.6 Mbits of total RAM bits are available for embedded data storage and buffering within logic designs.
• I/O capacity — 416 user I/O pins support extensive external connectivity and interface requirements.
• Package and mounting — Supplied in a 2104-BBGA / 2104-FCBGA package (2104-FCBGA (47.5x47.5)) with surface-mount mounting type for high-density PCB integration.
• Power — Documented supply range of 698 mV to 742 mV for the device supply domain.
• Operating conditions and grade — Extended grade device with an operating temperature range of 0°C to 100°C.
• Regulatory compliance — RoHS compliant.

Unique Advantages

• High logic capacity: 1,906,800 logic elements enable complex hardware functions and wide parallelism directly on-chip, reducing the need for external logic devices.
• Substantial embedded memory: Approximately 49.6 Mbits of RAM bits provide on-chip storage for buffering, state, and local data handling.
• Broad I/O count: 416 I/O pins allow extensive external interfacing without sacrificing internal resource allocation.
• Dense FCBGA package: The 2104-FCBGA (47.5x47.5) package supports high-density PCB layouts while maintaining surface-mount compatibility.
• Documented operating range: Extended grade with 0°C to 100°C operating temperature and a defined supply range (698–742 mV) aids in system-level power and thermal planning.
• RoHS compliance: Simplifies environmental and regulatory alignment for product designs.

Why Choose XCVU35P-L2FSVH2104E?

This AMD Virtex® UltraScale+™ FPGA provides a combination of extensive logic resources, significant embedded memory, and a high I/O count within a 2104-FCBGA package. The documented supply and temperature ranges, along with Extended grade classification and RoHS compliance, make the part suitable for designs that need well-characterized on-chip capacity and packaging density.

Choose XCVU35P-L2FSVH2104E for designs that require large programmable logic fabric and substantial on-chip RAM while maintaining a compact surface-mount package footprint and clearly stated electrical and thermal operating parameters.

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