XCVU35P-2FSVH2892E

The XCVU35P-2FSVH2892E is a Virtex® UltraScale+™ FPGA packaged in a 2892-FCBGA (55×55) surface-mount package. This extended-grade device delivers very large logic capacity, significant on-chip memory, and a broad I/O count for complex, board-mounted programmable logic designs.

With explicit electrical and thermal ranges, the device supports designs that require predictable supply and operating conditions while maintaining RoHS compliance.

Key Features

• Logic Capacity  1,906,800 logic cells (logic elements) to implement large-scale custom logic and complex datapaths.
• Embedded Memory  Approximately 49.6 Mbits of on-chip RAM (49,597,645 total RAM bits) for buffering, lookup tables, and state storage.
• I/O and Package  416 user I/O pins in a 2892-BBGA / 2892-FCBGA (55×55) package, enabling dense board-level connectivity in a surface-mount footprint.
• Power Supply  Specified core voltage supply range of 825 mV to 876 mV for predictable power planning and regulator selection.
• Operating Range & Grade  Extended grade device rated for 0 °C to 100 °C operating temperature.
• Mounting & Package Case  Surface mount device in a 2892-BBGA package case suitable for automated PCB assembly.
• Environmental Compliance  RoHS compliant.

Typical Applications

• High-density programmable logic — Implement large-scale custom logic functions using the device's 1,906,800 logic cells to consolidate complex designs onto a single FPGA.
• Memory-intensive designs — Use approximately 49.6 Mbits of embedded memory for buffering, packet storage, or lookup tables within the programmable fabric.
• I/O-heavy board integration — Leverage 416 I/O pins and the 2892-FCBGA package for systems that require numerous external interfaces and dense PCB routing.
• Extended-temperature applications — Deploy in systems operating within 0 °C to 100 °C where extended-grade components are required.

Unique Advantages

• Large on-chip logic capacity: 1,906,800 logic cells provide the headroom to implement complex algorithms and consolidate multiple functions in a single device.
• Substantial embedded memory: Approximately 49.6 Mbits of RAM reduces dependence on external memory for many buffering and packet-processing tasks.
• High I/O count in an FCBGA package: 416 I/O pins in a 2892-FCBGA (55×55) footprint enable dense board-level connectivity without sacrificing package-level integration.
• Defined supply and thermal ranges: Clear voltage supply (0.825–0.876 V) and operating temperature (0 °C–100 °C) simplify power and thermal design considerations.
• Surface-mount, assembly-ready package: The 2892-BBGA surface-mount form factor supports automated manufacturing processes.
• RoHS compliant: Meets lead-free and restricted-substance requirements for modern product assembly.

Why Choose XCVU35P-2FSVH2892E?

The XCVU35P-2FSVH2892E is positioned for designs that demand high logic density, extensive on-chip RAM, and a large number of I/O in a single surface-mount FCBGA package. Its extended grade rating and specified supply and temperature ranges provide clear electrical and thermal boundaries for system integration.

This device is suitable for engineering teams and procurement looking to consolidate complex programmable logic into a single, RoHS-compliant FPGA platform while maintaining clear packaging and power specifications for board-level implementation.

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