XCVU33P-3FSVH2104E

The XCVU33P-3FSVH2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC designed for high-density logic and memory integration. It provides a large logic capacity and substantial on-chip RAM in a 2104-FCBGA package for surface-mount designs.

With 961,800 logic elements, approximately 24.7 Mbits of embedded memory, and 208 user I/O, this extended-grade device targets demanding digital designs that require significant logic, memory, and I/O integration within a compact package.

Key Features

• Core Logic 961,800 logic elements to support large-scale digital designs and complex logic implementation.
• Embedded Memory Approximately 24.7 Mbits of on-chip RAM for buffering, lookup tables, and local data storage.
• Input/Output 208 I/O pins to interface with peripherals, high-speed transceivers, and board-level signals.
• Power Supported supply range from 873 mV to 927 mV for core power domain needs.
• Package & Mounting 2104-FCBGA (47.5x47.5) supplier device package; 2104-BBGA, FCBGA package case; surface-mount mounting type for PCB integration.
• Temperature & Grade Extended grade with an operating temperature range of 0 °C to 100 °C suitable for many commercial and industrial environments.
• Compliance RoHS compliant for environmental regulation alignment.

Typical Applications

• High-density digital processing Implement large logic networks and custom data paths using the device’s extensive logic element count and on-chip RAM.
• Signal processing Use embedded memory and plentiful logic resources for buffering, filtering, and parallel processing pipelines.
• Network and communications Leverage 208 I/O to connect network interfaces, protocol bridges, and data aggregation functions.
• Prototyping and system integration Integrate complex IP blocks and system functions in a single FCBGA package for board-level testing and validation.

Unique Advantages

• High logic density: 961,800 logic elements enable consolidation of complex digital functions into a single device, reducing system BOM.
• Substantial embedded memory: Approximately 24.7 Mbits of on-chip RAM supports local buffering and state storage without external memory.
• Ample I/O count: 208 I/O pins provide flexibility for interfacing multiple peripherals and system buses.
• Compact FCBGA package: 2104-FCBGA (47.5x47.5) packaging delivers a high-pin-count solution in a surface-mount form factor.
• Extended operating range: 0 °C to 100 °C grade covers many commercial and industrial deployment scenarios.
• Regulatory alignment: RoHS compliance supports environmentally restricted manufacturing requirements.

Why Choose XCVU33P-3FSVH2104E?

The XCVU33P-3FSVH2104E positions itself as a high-capacity FPGA option where large logic resources, substantial on-chip memory, and a generous I/O complement are required in a single surface-mount package. Its extended-grade temperature range and RoHS compliance make it suitable for a range of commercial and industrial applications that demand integration and density.

This device is suited to design teams building complex, scalable digital systems that benefit from consolidating logic and memory on-chip while keeping board-level routing and component count under control.

Request a quote or submit a pricing inquiry to obtain availability and lead-time information for the XCVU33P-3FSVH2104E. Our team can provide a formal quotation to support your procurement and design planning.