XCVU33P-2FSVH2104E

The XCVU33P-2FSVH2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC optimized for designs that require high logic capacity and substantial on-chip memory. It integrates a large array of logic elements, significant embedded RAM, and a high pin-count FCBGA package to support complex digital systems and dense I/O requirements.

Key Features

• Core Logic  Approximately 961,800 logic elements and 54,960 CLBs provide extensive fabric for implementing complex digital logic and custom hardware functions.
• Embedded Memory  Approximately 24.7 Mbits of on-chip RAM to support buffering, state storage, and data-path acceleration without external memory in many use cases.
• I/O Capacity  208 general-purpose I/Os to accommodate a broad range of interface requirements and high-density connectivity.
• Power Supply  Operates from a core voltage supply in the range of 825 mV to 876 mV, enabling precise core power management within the specified window.
• Package  2104-FCBGA package (47.5 × 47.5 mm) / 2104-BBGA form factor provides a high-pin-count, compact solution for board-level integration.
• Mounting & Compliance  Surface mount device with RoHS compliance for environmental and manufacturing compatibility.
• Temperature & Grade  Extended grade device rated for an operating range of 0 °C to 100 °C suitable for a variety of commercial and extended-temperature applications.

Typical Applications

• High-density digital systems  Use the XCVU33P-2FSVH2104E when designs require a large number of logic elements and on-chip memory for complex algorithm implementation.
• Multi-channel I/O aggregation  Leverage 208 I/Os to consolidate and manage numerous parallel interfaces and control signals on a single FPGA.
• Embedded compute accelerators  Deploy embedded RAM and extensive logic resources to implement custom accelerators and data-path processing blocks.

Unique Advantages

• High logic capacity: Approximately 961,800 logic elements enable implementation of large, feature-rich designs without excessive partitioning.
• Substantial on-chip memory: Around 24.7 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Dense I/O support: 208 I/Os simplify board-level routing and system integration for multi-interface designs.
• Compact high-pin-count package: The 2104-FCBGA (47.5 × 47.5 mm) package delivers a high pin density in a surface-mount form factor for space-constrained PCBs.
• Extended operating range: Rated 0 °C to 100 °C and specified as Extended grade to match a range of commercial and extended-temperature system requirements.
• RoHS compliant: Meets RoHS requirements for environmentally conscious manufacturing and supply-chain compatibility.

Why Choose XCVU33P-2FSVH2104E?

The XCVU33P-2FSVH2104E positions itself as a high-capacity, flexible FPGA option within the Virtex® UltraScale+™ family, combining nearly one million logic elements with approximately 24.7 Mbits of embedded RAM and a 208-pin I/O complement. Its 2104-FCBGA package and surface-mount design offer a dense, integrable solution for designs that require substantial on-chip resources and high I/O density within an extended operating range.

This device is well suited for development and production systems where scalability of logic and memory resources, compact high-pin-count packaging, and compliance with RoHS are important selection criteria.

Request a quote or submit a pricing inquiry to evaluate the XCVU33P-2FSVH2104E for your next design.