XCVU31P-L2FSVH1924E

The XCVU31P-L2FSVH1924E is a Virtex® UltraScale+™ field programmable gate array (FPGA) in a 1924‑ball FCBGA package. It provides a large logic capacity and on‑chip memory in a surface‑mount package with extended grade operation.

With 961,800 logic elements, approximately 24.7 Mbits of embedded memory, and 208 user I/O, this device is targeted at designs that require significant programmable logic and memory resources in a compact FCBGA footprint.

Key Features

• Core Logic  961,800 logic elements provide the primary programmable fabric for implementing complex digital logic and custom accelerators.
• Configurable Logic Blocks (CLBs)  Logic capacity is organized to support large-scale designs across the UltraScale+ architecture.
• Embedded Memory  Approximately 24.7 Mbits of on‑chip RAM supports buffering, frame storage, and intermediate data processing without relying solely on external memory.
• High I/O Count  208 user I/O pins enable connectivity to external peripherals and interfaces in dense system designs.
• Package and Mounting  Supplied in a 1924‑FCBGA (45×45) package with surface‑mount mounting for compact board integration.
• Power Supply Range  Specified core voltage range of 698 mV to 742 mV for device operation.
• Temperature Grade  Extended grade operation from 0 °C to 100 °C for applications that require above‑room temperature endurance.
• Regulatory  RoHS compliant.

Unique Advantages

• Substantial Logic Capacity: 961,800 logic elements enable implementation of large, complex designs without partitioning across multiple devices.
• Significant On‑Chip Memory: Approximately 24.7 Mbits of embedded RAM reduces dependence on external memory for many buffering and data‑path needs.
• Compact FCBGA Package: The 1924‑FCBGA (45×45) package delivers high integration density for space‑constrained boards while preserving a high I/O count.
• Broad I/O Connectivity: 208 user I/O pins provide flexibility for interfacing to a wide range of external components and subsystems.
• Extended Operating Range: Rated for 0 °C to 100 °C operation and RoHS compliance to meet environmental and regulatory considerations.

Why Choose XCVU31P-L2FSVH1924E?

The XCVU31P-L2FSVH1924E positions itself as a high‑capacity UltraScale+ FPGA option that combines nearly one million logic elements with substantial embedded memory and a high I/O count in a compact 1924‑FCBGA package. Its electrical and thermal specifications—core voltage range of 698 mV to 742 mV and an operating temperature range of 0 °C to 100 °C—support designs that require extended‑grade operation and significant on‑chip resources.

This device is well suited for engineers and teams that need large programmable fabric and embedded RAM within a surface‑mount FCBGA footprint, offering a balance of integration density and connectivity for complex FPGA implementations.

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