XCVU35P-L2FSVH2892E

The XCVU35P-L2FSVH2892E is a Virtex® UltraScale+™ Field Programmable Gate Array in a 2892-ball FCBGA package. It provides very high logic capacity, substantial on-chip RAM, and a large number of I/O pins in a surface-mount package targeted at designs that require dense programmable logic integration.

Key on-chip resources include 1,906,800 logic elements, approximately 49.6 Mbits of embedded memory, and 416 I/O pins. The device is supplied with an operating voltage window of 698 mV to 742 mV and an operating temperature range of 0 °C to 100 °C (Extended grade).

Key Features

• Core Logic Capacity — 1,906,800 logic elements provide extensive programmable logic resources to implement large-scale designs.
• Configurable Logic Blocks — 108,960 configurable logic blocks for structured logic partitioning and resource management.
• Embedded Memory — Approximately 49.6 Mbits of total RAM bits of on-chip memory to support buffering, state machines, and local storage without relying solely on external memory.
• I/O Density — 416 I/O pins available for broad interfacing to peripherals, daughter cards, or external systems.
• Package and Mounting — 2892-BBGA / 2892-FCBGA (55 × 55 mm) surface-mount package for high-density board integration.
• Power Supply — Defined core supply range from 698 mV to 742 mV to match target system power architectures.
• Temperature & Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Compliance — RoHS compliant for environmental and manufacturing considerations.

Typical Applications

• High-density digital systems — Use the device’s large logic element count and embedded memory to implement complex digital datapaths and control logic.
• Custom hardware acceleration — Leverage substantial on-chip resources to implement application-specific accelerators without immediate dependence on off-chip RAM.
• Multi-I/O interface hubs — Utilize 416 I/O pins to consolidate multiple peripheral and board-level interfaces in a single FPGA solution.

Unique Advantages

• High logic density: 1,906,800 logic elements enable integration of large logic functions and reduce the need for multiple programmable devices.
• Significant embedded memory: Approximately 49.6 Mbits of on-chip RAM helps minimize external memory requirements for buffering and local storage.
• Broad I/O capability: 416 I/O pins allow flexible interfacing options and simplify system wiring and PCB routing for complex designs.
• Compact, high-ball-count package: 2892-FCBGA (55 × 55 mm) supports dense board layouts while delivering the device’s full resource set.
• Controlled supply window: Specified core voltage range (698 mV–742 mV) enables clear power-supply planning for system designs.
• Extended operating grade: Rated for 0 °C to 100 °C operation to match a range of commercial and extended-environment applications.

Why Choose XCVU35P-L2FSVH2892E?

The XCVU35P-L2FSVH2892E positions itself for designs that demand very high logic capacity, generous on-chip memory, and extensive I/O in a single surface-mount FCBGA package. Its combination of 1,906,800 logic elements, approximately 49.6 Mbits of embedded RAM, and 416 I/O pins supports consolidation of complex functions and reduces dependency on multiple discrete components.

This device is suited to development teams and system designers who need scalable, high-density programmable logic with a clearly defined power and temperature envelope. RoHS compliance and a standardized 2892-ball FCBGA package simplify procurement and assembly for production environments.

If you would like pricing, availability, or to request a formal quote for the XCVU35P-L2FSVH2892E, submit an inquiry or request a quote through your preferred procurement channel. Provide the part number and required quantities to begin the process.