XCVU440-2FLGB2377I
| Part Description |
Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC 1300 90726400 5540850 2377-BBGA, FCBGA |
|---|---|
| Quantity | 410 Available (as of October 8, 2026) |
| Product Category | Field Programmable Gate Array (FPGA) |
|---|---|
| Manufacturer | AMD |
| Manufacturing Status | Active |
| Manufacturer Standard Lead Time | 24 Weeks |
| Datasheet |
Specifications & Environmental
| Device Package | 2377-FCBGA (50x50) | Grade | Industrial | Operating Temperature | -40°C – 100°C | ||
|---|---|---|---|---|---|---|---|
| Package / Case | 2377-BBGA, FCBGA | Number of I/O | 1300 | Voltage | 922 mV - 979 mV | ||
| Mounting Method | Surface Mount | RoHS Compliance | ROHS3 Compliant | REACH Compliance | REACH Unaffected | ||
| Moisture Sensitivity Level | 4 (72 Hours) | Number of LABs/CLBs | 316620 | Number of Logic Elements/Cells | 5540850 | ||
| Number of Gates | N/A | ECCN | 3A001A7A | HTS Code | 8542.39.0001 | ||
| Qualification | N/A | Total RAM Bits | 90726400 |
Overview of XCVU440-2FLGB2377I – Virtex® UltraScale™ FPGA, 2377-FCBGA
The XCVU440-2FLGB2377I is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It integrates a very large logic capacity with substantial on-chip memory and a high I/O count in a 2377-ball FCBGA package.
Designed for engineers who need high-density programmable logic in an industrial-grade device, this FPGA provides 5,540,850 logic elements, approximately 90.7 Mbits of embedded memory, and 1,300 I/O pins—attributes that support complex, I/O-intensive designs while operating across a wide industrial temperature range.
Key Features
- Core Logic 5,540,850 logic elements provide extensive programmable logic resources for complex digital designs.
- Embedded Memory Approximately 90.7 Mbits of on-chip RAM available for high-capacity buffering, lookup tables, and data storage.
- I/O Capacity 1,300 I/O pins support dense external interfacing and parallel connectivity needs.
- Package and Mounting 2377-FCBGA (50×50) package, surface-mount mounting type, suitable for compact board-level integration.
- Power Supply Core supply range of 0.922 V to 0.979 V to match system power design requirements.
- Operating Range Industrial-grade device rated for operation from −40 °C to 100 °C.
- Environmental Compliance RoHS compliant.
Unique Advantages
- High Logic Density: Over 5.5 million logic elements enable implementation of large, highly parallel designs on a single device, reducing board-level complexity.
- Substantial On-Chip Memory: Approximately 90.7 Mbits of embedded RAM simplifies data handling and reduces external memory requirements.
- Extensive I/O Count: 1,300 I/O pins permit broad interfacing options for multi-channel and high-throughput systems.
- Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in thermally demanding environments.
- Compact FCBGA Packaging: 2377-ball FCBGA (50×50) provides a high-pin-count solution in a package optimized for dense PCB layouts.
- Vendor Proven Platform: Part of the Virtex® UltraScale™ family from AMD, offering a known FPGA architecture for design continuity.
Why Choose XCVU440-2FLGB2377I?
The XCVU440-2FLGB2377I combines very large programmable logic capacity, significant embedded memory, and a high number of I/O in an industrial-grade FCBGA package. These attributes make it well suited to designs that require on-chip integration of compute, buffering, and dense external connectivity while maintaining operation across a wide temperature range.
Choose this FPGA when your project demands scalability in logic and memory resources, a high pin count for complex interfaces, and compliance with RoHS requirements backed by AMD as the manufacturer.
Request a quote or submit an inquiry to check availability and pricing for the XCVU440-2FLGB2377I.

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Certifications and Memberships: ISO9001:2015, RoHS, REACH








