XCVU440-2FLGB2377I

IC FPGA 1300 I/O 2377FCBGA
Part Description

Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC 1300 90726400 5540850 2377-BBGA, FCBGA

Quantity 410 Available (as of October 8, 2026)
Product CategoryField Programmable Gate Array (FPGA)
ManufacturerAMD
Manufacturing StatusActive
Manufacturer Standard Lead Time24 Weeks
Datasheet

Specifications & Environmental

Device Package2377-FCBGA (50x50)GradeIndustrialOperating Temperature-40°C – 100°C
Package / Case2377-BBGA, FCBGANumber of I/O1300Voltage922 mV - 979 mV
Mounting MethodSurface MountRoHS ComplianceROHS3 CompliantREACH ComplianceREACH Unaffected
Moisture Sensitivity Level4 (72 Hours)Number of LABs/CLBs316620Number of Logic Elements/Cells5540850
Number of GatesN/AECCN3A001A7AHTS Code8542.39.0001
QualificationN/ATotal RAM Bits90726400

Overview of XCVU440-2FLGB2377I – Virtex® UltraScale™ FPGA, 2377-FCBGA

The XCVU440-2FLGB2377I is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC from AMD. It integrates a very large logic capacity with substantial on-chip memory and a high I/O count in a 2377-ball FCBGA package.

Designed for engineers who need high-density programmable logic in an industrial-grade device, this FPGA provides 5,540,850 logic elements, approximately 90.7 Mbits of embedded memory, and 1,300 I/O pins—attributes that support complex, I/O-intensive designs while operating across a wide industrial temperature range.

Key Features

  • Core Logic 5,540,850 logic elements provide extensive programmable logic resources for complex digital designs.
  • Embedded Memory Approximately 90.7 Mbits of on-chip RAM available for high-capacity buffering, lookup tables, and data storage.
  • I/O Capacity 1,300 I/O pins support dense external interfacing and parallel connectivity needs.
  • Package and Mounting 2377-FCBGA (50×50) package, surface-mount mounting type, suitable for compact board-level integration.
  • Power Supply Core supply range of 0.922 V to 0.979 V to match system power design requirements.
  • Operating Range Industrial-grade device rated for operation from −40 °C to 100 °C.
  • Environmental Compliance RoHS compliant.

Unique Advantages

  • High Logic Density: Over 5.5 million logic elements enable implementation of large, highly parallel designs on a single device, reducing board-level complexity.
  • Substantial On-Chip Memory: Approximately 90.7 Mbits of embedded RAM simplifies data handling and reduces external memory requirements.
  • Extensive I/O Count: 1,300 I/O pins permit broad interfacing options for multi-channel and high-throughput systems.
  • Industrial Temperature Rating: Specified operation from −40 °C to 100 °C supports deployment in thermally demanding environments.
  • Compact FCBGA Packaging: 2377-ball FCBGA (50×50) provides a high-pin-count solution in a package optimized for dense PCB layouts.
  • Vendor Proven Platform: Part of the Virtex® UltraScale™ family from AMD, offering a known FPGA architecture for design continuity.

Why Choose XCVU440-2FLGB2377I?

The XCVU440-2FLGB2377I combines very large programmable logic capacity, significant embedded memory, and a high number of I/O in an industrial-grade FCBGA package. These attributes make it well suited to designs that require on-chip integration of compute, buffering, and dense external connectivity while maintaining operation across a wide temperature range.

Choose this FPGA when your project demands scalability in logic and memory resources, a high pin count for complex interfaces, and compliance with RoHS requirements backed by AMD as the manufacturer.

Request a quote or submit an inquiry to check availability and pricing for the XCVU440-2FLGB2377I.

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