XCVU45P-3FSVH2892E

The XCVU45P-3FSVH2892E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD, provided in a 2892-FCBGA (55×55) package. It delivers large on-chip logic and memory resources in a surface-mount FCBGA footprint.

This device targets designs that require substantial programmable logic capacity, significant embedded memory, and a high number of I/O pins, while operating within a defined extended temperature and supply voltage range.

Key Features

• Core Logic  Approximately 1,906,800 logic elements for implementing large-scale programmable logic and custom digital functions.
• Embedded Memory  Approximately 49.6 Mbits of on-chip RAM (49,597,645 total RAM bits) to support deep buffering, LUTRAM, and on-die storage needs.
• I/O Resources  416 dedicated I/O pins to support multi-channel interfaces and board-level connectivity.
• Package and Mounting  2892-FCBGA (55×55) supplier device package, 2892-BBGA FCBGA package case, surface-mount mounting type for compact, high-pin-count board integration.
• Power  Specified core/voltage supply range of 825 mV to 876 mV for power planning and supply design.
• Operating Range and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• Custom hardware acceleration  Use the large logic element count and on-chip RAM to implement application-specific accelerators and datapath logic.
• I/O-rich interface aggregation  416 I/O pins enable complex multi-channel interfacing and board-level connectivity for systems that require many external signals.
• High-density digital systems  The combination of nearly 1.9M logic elements and ~49.6 Mbits of embedded memory supports dense, feature-rich digital designs and prototypes.
• Compact, high-pin deployments  The 2892-FCBGA (55×55) surface-mount package enables integration of high-pin-count FPGAs into compact board layouts.

Unique Advantages

• Large programmable fabric: Delivers approximately 1,906,800 logic elements to implement extensive custom logic without immediate need for external hardware acceleration.
• Substantial on-chip memory: Approximately 49.6 Mbits of embedded RAM reduces reliance on external memory for many buffering and storage tasks.
• High I/O density: 416 I/O pins simplify multi-channel interfacing and reduce the need for additional bridging components.
• High-pin-count, compact package: 2892-FCBGA (55×55) package supports dense integration while providing the signal routing capacity required for complex designs.
• Tightly defined supply window: The 825 mV–876 mV voltage supply range helps with precise power-supply design and planning.
• Extended operating grade: 0 °C to 100 °C operating range offers suitability for applications requiring operation across a broader temperature span.

Why Choose XCVU45P-3FSVH2892E?

The XCVU45P-3FSVH2892E balances very large logic capacity, significant embedded memory, and a high I/O count in a single, high-pin-count FCBGA package from AMD. Its specified voltage range and extended temperature grade provide clear electrical and thermal parameters for system-level design decisions.

This device is appropriate for designers who need a high-density FPGA platform with substantial on-chip resources and compact package integration. Backed by AMD as the manufacturer, the part fits applications where logic capacity, embedded memory, and I/O count are primary selection criteria.

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