XCVU5P-1FLVC2104E

The XCVU5P-1FLVC2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It provides a large programmable logic capacity and substantial on-chip memory in a high-pin-count FCBGA package for surface-mount PCB assembly.

With 1,313,763 logic elements and 416 device I/O, this device is intended for designs that require high logic density, wide I/O connectivity, and significant embedded memory resources while operating within an extended-grade temperature range.

Key Features

• Programmable Logic Capacity — Approximately 1,313,763 logic elements to implement complex custom digital functions.
• Embedded Memory — Approximately 191 Mbits of embedded memory for buffering, FIFOs, and on-chip data storage.
• I/O Density — 416 device I/O pins to support broad interfacing and multi-channel connectivity requirements.
• Packaging — 2104-FCBGA (47.5 × 47.5 mm) package case providing a high pin-count footprint for dense board-level integration.
• Power — Core voltage supply range of 825 mV to 876 mV, suitable for designs targeting the specified core operating range.
• Mounting & Compliance — Surface mount device; RoHS compliant.
• Operating Range — Extended-grade operating temperature from 0 °C to 100 °C for applications within this thermal envelope.

Typical Applications

• High-density digital systems — Implement large-scale custom logic and complex state machines using the device's significant logic element count.
• I/O-intensive designs — Leverage 416 I/O pins for multi-channel interfaces, parallel buses, or mixed-signal front-end routing.
• On-chip data buffering — Use approximately 191 Mbits of embedded memory for packet buffering, frame storage, or intermediate data processing.

Unique Advantages

• High programmable capacity: Approximately 1.31 million logic elements enable implementation of large or highly parallel designs without external logic.
• Substantial on-chip memory: Around 191 Mbits of embedded RAM reduces dependency on external memory for many buffering and processing tasks.
• Extensive I/O: 416 I/O pins provide flexible connectivity for complex system interfaces and multi-channel designs.
• High-pin FCBGA package: 2104-FCBGA (47.5×47.5 mm) supports dense interconnects and high signal count board designs.
• RoHS compliant and surface-mount: Meets common environmental requirements and standard PCB assembly processes.
• Extended-grade operation: Rated for 0 °C to 100 °C to match systems designed for this thermal range.

Why Choose XCVU5P-1FLVC2104E?

The XCVU5P-1FLVC2104E positions itself as a high-capacity Virtex® UltraScale+™ FPGA option from AMD, combining large programmable logic resources, significant embedded memory, and broad I/O in a single FCBGA package. This combination makes it suitable for designers who need to consolidate complex digital functions and heavy buffering on-chip while maintaining high I/O connectivity.

Choose this device for designs that require scalable logic capacity and robust on-chip memory within an extended operating temperature range, backed by the Virtex UltraScale+ product family pedigree.

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