XCVU9P-1FLGA2577E

The XCVU9P-1FLGA2577E is a Virtex UltraScale+ field programmable gate array (FPGA) IC that provides very large programmable logic and embedded memory resources in a high-density FCBGA package. It is intended for designs that require substantial on-chip logic capacity and memory while operating within specified supply and thermal ranges.

Key Features

• Programmable Logic Capacity  2,586,150 logic elements and 147,780 configurable logic blocks (CLBs) provide extensive resources for complex logic implementations.
• Embedded Memory  Approximately 391 Mbits of on-chip RAM to support data buffering, FIFOs, and large on-chip storage requirements.
• I/O Resources  448 I/O pins to accommodate diverse high-pin-count interfaces and board-level connectivity.
• Package and Mounting  2577-FCBGA (2577-BBGA) package in a 52.5 × 52.5 mm footprint, designed for surface-mount applications where high-density routing is required.
• Power Supply Range  Operates with core supply voltage between 825 mV and 876 mV, enabling designs matched to this supply window.
• Operating Temperature and Grade  Extended grade device specified for operation from 0 °C to 100 °C.
• Compliance  RoHS compliant.

Unique Advantages

• High logic and memory integration: The combination of over 2.5 million logic elements and roughly 391 Mbits of embedded RAM reduces dependence on external logic and memory devices.
• Large I/O count: 448 I/O pins enable complex board-level interfacing without sacrificing internal resources.
• Dense package footprint: 2577-FCBGA in a 52.5 × 52.5 mm package concentrates capacity into a single surface-mount component, simplifying system integration.
• Defined power envelope: A specific core voltage range (825–876 mV) allows precise power budgeting during system design.
• Extended temperature range: Rated for 0 °C to 100 °C operation, suitable for applications requiring above-ambient tolerance within that range.

Why Choose XCVU9P-1FLGA2577E?

The XCVU9P-1FLGA2577E positions itself as a high-capacity FPGA solution focused on designs that need a large collection of on-chip logic elements and substantial embedded memory in a compact FCBGA package. Its combination of extensive logic, significant RAM, and a high I/O count supports complex, tightly integrated system designs where consolidating functionality on a single device is valuable.

This extended-grade device, with clearly specified supply and temperature ranges and RoHS compliance, offers predictable integration into development and production flows where these exact specs align with system requirements. It is suitable for customers prioritizing high logic density, large embedded memory, and a compact, surface-mount FCBGA form factor.

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