XCVU9P-2FLGC2104E

The XCVU9P-2FLGC2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) by AMD provided in a 2104-FCBGA package. It offers a high count of programmable logic and on-chip memory, combined with a large number of I/O, making it suitable for dense, I/O‑intensive designs.

This device provides 2,586,150 logic elements and approximately 391 Mbits of embedded memory, enabling implementation of large, complex programmable functions while operating within an extended-grade temperature range.

Key Features

• Core Logic  2,586,150 logic elements for implementing high-density programmable logic and complex digital designs.
• Embedded Memory  Approximately 391 Mbits of on-chip RAM to support large data buffering, lookup tables, and state storage.
• I/O Capacity  416 user I/O pins to support extensive external interfacing and parallel connectivity.
• Package  2104-FCBGA package (47.5 × 47.5 mm) in a ball-grid array format for high pin count, surface-mount board integration.
• Power  Core voltage supply range from 825 mV to 876 mV to match system power rail requirements.
• Temperature & Grade  Extended grade operation from 0 °C to 100 °C for applications requiring broader temperature tolerance than commercial-only devices.
• Mounting  Surface mount device (SMD) for standard PCB assembly processes.
• Compliance  RoHS compliant for restriction of certain hazardous substances in the device.

Unique Advantages

• Very high logic density: 2,586,150 logic elements enable consolidation of large designs onto a single FPGA, reducing part count.
• Substantial on-chip memory: Approximately 391 Mbits of embedded RAM supports deep buffering, large lookup tables, and complex state machines without external memory.
• High I/O count: 416 I/Os provide abundant connectivity for parallel buses, multiple interfaces, or high-channel-count systems.
• Compact high-pin package: 2104-FCBGA (47.5 × 47.5 mm) delivers a high-pin-count solution in a single, manufacturable surface-mount package.
• Extended operating range: 0 °C to 100 °C and extended-grade designation help support designs operating beyond typical commercial conditions.
• Regulatory compliance: RoHS compliance aids in meeting environmental and supply-chain requirements.

Why Choose XCVU9P-2FLGC2104E?

The XCVU9P-2FLGC2104E combines very high logic density, large embedded memory, and substantial I/O capacity in a 2104-FCBGA surface-mount package. These measurable attributes make it well suited to demanding programmable designs that require consolidation of functions, extensive buffering, and numerous external interfaces.

With an extended-grade temperature range and a defined core voltage window, this device delivers a clearly specified platform for engineers and procurement teams seeking a high-density Virtex® UltraScale+™ FPGA solution from AMD.

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