XCVU9P-2FSGD2104I

The XCVU9P-2FSGD2104I is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD designed for high-density, high-I/O embedded logic implementations. With millions of logic elements, extensive on-chip memory, and hundreds of I/O, this industrial-grade FPGA addresses designs that require large programmable logic capacity and significant embedded RAM.

Key Features

• Core Logic  Contains 2,586,150 logic elements to implement large-scale digital logic and complex programmable functions.
• Embedded Memory  Provides approximately 391 Mbits of on-chip RAM for data buffering, state storage, and memory-intensive processing tasks.
• I/O Capacity  Up to 676 I/O pins to support wide interfacing options and high-density signal routing.
• Power Supply  Specifies a core voltage supply range of 825 mV to 876 mV for the programmable fabric.
• Package & Mounting  Delivered in a 2104-BBGA / 2104-FCBGA package (47.5×47.5 mm) for surface-mount PCB integration.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C, suitable for industrial environments.
• Regulatory  RoHS compliant.

Typical Applications

• High-density digital systems  Implement complex logic functions and custom accelerators that require millions of logic elements.
• Memory-intensive processing  Leverage approximately 391 Mbits of embedded memory for buffering, large state machines, or on-chip data storage.
• Industrial control and automation  Deploy in systems operating across −40 °C to 100 °C where industrial-grade components are required.
• High-connectivity interface hubs  Use the 676 I/O pins to aggregate and route large numbers of signals between subsystems.

Unique Advantages

• Large programmable capacity: 2,586,150 logic elements enable integration of multiple functions into a single device, reducing board-level complexity.
• Substantial embedded memory: Approximately 391 Mbits of on-chip RAM reduces dependence on external memory for many buffering and caching tasks.
• High I/O density: 676 I/O pins provide flexibility for complex interfacing and high channel counts without the need for external expanders.
• Industrial-ready thermal range: Rated −40 °C to 100 °C to match demanding environmental requirements in industrial applications.
• Compact surface-mount package: 2104-FCBGA (47.5×47.5 mm) package supports high-density PCB designs while maintaining robust mounting.
• Regulatory compliance: RoHS compliance supports environmentally conscious product designs and procurement.

Why Choose XCVU9P-2FSGD2104I?

The XCVU9P-2FSGD2104I positions itself as a high-capacity, industrial-grade FPGA solution combining millions of logic elements, extensive on-chip memory, and a large I/O complement in a surface-mount FCBGA package. It is suited to designers and engineering teams who need to consolidate complex digital functions, support memory-heavy processing, and accommodate high signal density within an industrial temperature envelope.

Choosing this device supports scalable designs that prioritize integration and reliability while reducing external component count. Its combination of logic, memory, and I/O makes it appropriate for advanced embedded systems and high-density programmable applications.

Request a quote or submit a purchase inquiry today to evaluate the XCVU9P-2FSGD2104I for your next high-density FPGA design.