XCVU9P-3FLGB2104E

The XCVU9P-3FLGB2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC designed to deliver very large logic capacity and significant on-chip memory in a high-density FCBGA package. This device provides a combination of millions of logic elements, extensive embedded memory, and hundreds of I/O for designs that require high integration within a compact surface-mount package.

Key attributes provided in the data include approximately 2,586,150 logic elements, approximately 391 Mbits of embedded memory, and 702 I/O, with an extended operating grade and a voltage supply range of 873 mV to 927 mV.

Key Features

• Logic Capacity  Approximately 2,586,150 logic elements, supporting very high-density digital implementations and complex combinational and sequential logic designs.
• Embedded Memory  Approximately 391 Mbits of on-chip RAM, enabling large data buffers, look-up tables, and memory-intensive algorithms without external memory in many cases.
• I/O Count  702 I/O pins to support extensive peripheral connectivity, multiple interfaces, and high-pin-count system designs.
• Package and Mounting  2104-FCBGA package (47.5×47.5 mm) with surface-mount mounting for compact, board-level integration; package case listed as 2104-BBGA, FCBGA.
• Power  Specified voltage supply range of 873 mV to 927 mV, allowing design attention to the device's defined supply window.
• Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C for applications that require elevated ambient operation within that range.
• Compliance  RoHS compliant, meeting common environmental regulations for lead-free assemblies.

Typical Applications

• High-density logic implementations  Use where large numbers of logic elements are required to implement complex state machines, signal processing pipelines, or custom accelerators.
• Memory-intensive designs  Embedded memory capacity supports buffering, lookup tables, and on-chip data storage for real-time processing tasks.
• High-pin-count systems  High I/O count supports multi-channel interfaces, dense sensor arrays, or extensive peripheral connectivity on a single FPGA.

Unique Advantages

• High logic density: Approximately 2.59 million logic elements enable consolidation of large functions onto a single device, reducing system complexity.
• Substantial on-chip memory: Approximately 391 Mbits of embedded RAM reduces dependence on external memory and simplifies board-level designs.
• Extensive I/O: 702 I/O pins provide flexibility for routing multiple interfaces and parallel channels without needing additional devices.
• Compact high-pin-count package: The 2104-FCBGA (47.5×47.5 mm) package packs capacity into a surface-mount form factor suitable for dense PCB layouts.
• Defined operating window: Extended grade and 0 °C to 100 °C operating range with a specified supply range (873–927 mV) give clear parameters for thermal and power planning.
• RoHS compliant: Supports lead-free assembly and common environmental requirements.

Why Choose XCVU9P-3FLGB2104E?

The XCVU9P-3FLGB2104E positions itself as a high-capacity FPGA option for designs that demand very large logic resources, significant embedded memory, and numerous I/O in a single, compact package. Its specification set supports integration of complex digital functions and large data handling on a single device while providing clear electrical and thermal operating ranges for system designers.

This device is suited to teams and projects that prioritize consolidation of functionality, reduced board-level complexity, and predictable supply and thermal planning. Its combination of logic capacity, on-chip RAM, and I/O density delivers long-term design scalability within the constraints provided in the product data.

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