XCVU9P-L2FLGA2104E

The XCVU9P-L2FLGA2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) in a 2104-FCBGA package. It provides high-capacity programmable logic and substantial on-chip memory in a surface-mount BGA form factor.

With approximately 2,586,150 logic elements, roughly 391 Mbits of embedded memory, and 832 I/O, this device is targeted at designs that require large logic capacity, significant on-chip storage, and dense external connectivity while operating in an extended temperature range.

Key Features

• Core Logic Capacity  Approximately 2,586,150 logic elements for large-scale programmable logic implementations.
• Embedded Memory  Approximately 391 Mbits of embedded memory to support on-chip buffering, frame storage, and data paths.
• I/O Count  832 I/O to enable dense external interfacing and parallel signal connectivity.
• Package  2104-FCBGA package (47.5 × 47.5 mm) providing a high-pin-count BGA footprint for compact, high-density PCB designs.
• Power Supply  Defined voltage supply range of 698 mV to 742 mV for core operation.
• Temperature & Grade  Extended grade with an operating temperature range of 0 °C to 110 °C.
• Mounting & Compliance  Surface mount device, RoHS compliant for environmental regulatory alignment.

Typical Applications

• Large-scale programmable logic  Implement complex custom logic and state machines that require extensive logic element capacity.
• On-chip buffering and data storage  Leverage approximately 391 Mbits of embedded memory for high-throughput buffering and temporary storage within the FPGA fabric.
• I/O-intensive systems  Use the 832 I/O to interface with many external devices, parallel buses, and multi-lane data connections.

Unique Advantages

• High logic density: Approximately 2,586,150 logic elements enable consolidation of large designs into a single device, reducing system complexity.
• Substantial embedded memory: Roughly 391 Mbits of on-chip RAM supports sizable data buffering and state retention without external memory.
• Extensive connectivity: 832 I/O provides flexibility for high-pin-count interfaces and parallel signal routing.
• High-pin-count BGA package: The 2104-FCBGA (47.5 × 47.5 mm) package accommodates dense routing and power delivery for complex designs.
• Defined core power window: A voltage supply range of 698 mV to 742 mV provides a precise core operating specification for power design.
• Extended temperature rating: 0 °C to 110 °C operating range and Extended grade support deployment in environments requiring wider thermal tolerance.

Why Choose XCVU9P-L2FLGA2104E?

The XCVU9P-L2FLGA2104E combines very large logic capacity, substantial embedded memory, and a high I/O count in a single surface-mount 2104-FCBGA package. These attributes make it suitable for designs that need to consolidate complex logic, maintain large on-chip data sets, and provide dense external connectivity while operating across an extended temperature range.

Its RoHS compliance and defined electrical and thermal specifications support predictable system integration and long-term use in applications where board-level density and on-chip resources are primary considerations.

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