XCVU9P-L2FSGD2104E

The XCVU9P-L2FSGD2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, supplied in a 2104-BBGA FCBGA package (2104-FCBGA, 47.5×47.5). It provides large on-chip resources and a high I/O count for designs needing significant programmable logic and embedded memory capacity.

Key device characteristics include 2,586,150 logic elements, approximately 391 Mbits of embedded memory, 676 I/O pins, an extended temperature grade (0 °C to 110 °C), and a supply voltage range of 698 mV to 742 mV, all in a surface-mount FCBGA package.

Key Features

• Core Capacity  2,586,150 logic elements to support large-scale programmable logic implementations and complex design integration.
• Embedded Memory  Approximately 391 Mbits of on-chip RAM for data buffering, large LUT-based functions, and memory-intensive logic.
• I/O and Integration  676 I/O pins to accommodate dense external interfacing and multi-channel connectivity at the board level.
• Package and Mounting  2104-FCBGA (47.5×47.5) package in a surface-mount form factor for compact, board-level integration.
• Power  Specified supply voltage range of 698 mV to 742 mV to match system power domains and regulator designs.
• Temperature and Grade  Extended-grade device rated for operation from 0 °C to 110 °C, suitable for thermally demanding deployed equipment.
• Regulatory Status  RoHS compliant for use in assemblies requiring lead-free component status.

Typical Applications

• High-capacity programmable logic  For designs that require large numbers of logic elements and extensive on-chip RAM to implement complex digital functions.
• High I/O systems  For systems that require a large number of external interfaces and parallel connectivity options.
• Board-level integration  Surface-mount 2104-FCBGA package supports compact, high-density carrier board designs.
• Extended-temperature deployments  Devices and systems operating across 0 °C to 110 °C temperature ranges where extended-grade components are required.

Unique Advantages

• High on-chip logic density: 2,586,150 logic elements enable consolidation of complex functions within a single device, reducing external component count.
• Substantial embedded memory: Approximately 391 Mbits of RAM supports large buffers, LUT storage, and memory-heavy algorithms without immediate reliance on external memory.
• Extensive external connectivity: 676 I/O pins provide flexibility for multi-channel interfaces and parallel signal conditioning.
• Compact, surface-mount package: 2104-FCBGA (47.5×47.5) footprint simplifies board layout for space-constrained designs.
• Extended operating range: 0 °C to 110 °C grade supports applications requiring wider thermal tolerance than standard commercial parts.
• RoHS compliant: Meets lead-free requirements for assemblies targeting RoHS conformance.

Why Choose XCVU9P-L2FSGD2104E?

The XCVU9P-L2FSGD2104E positions itself as a high-capacity, extended-grade Virtex® UltraScale+™ FPGA suitable for designs that demand significant programmable logic, large embedded memory, and a high I/O count in a compact surface-mount package. Its combination of logic elements, on-chip RAM, and 676 I/O pins supports integration of complex digital systems onto a single device.

Engineers and procurement teams looking for a scalable, high-resource FPGA from AMD can consider this part when their designs require consolidation of functions, substantial on-chip storage, and extended temperature operation for robust board-level implementations.

Request a quote or submit an inquiry to obtain pricing, availability, and lead-time information for the XCVU9P-L2FSGD2104E.