XCVU9P-L2FLGB2104E

The XCVU9P-L2FLGB2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) from AMD, supplied in a 2104-FCBGA package. It delivers very high logic capacity, substantial embedded memory, and a large number of I/O pins for complex digital designs.

Its combination of approximately 2,586,150 logic elements, approximately 391 Mbits of embedded memory and 702 I/Os makes it suitable for designs that require dense programmable logic, significant on-chip storage, and wide external connectivity while operating within an extended temperature range.

Key Features

• Logic Capacity  Approximately 2,586,150 logic elements provide a large programmable fabric for complex custom logic and high-density designs.
• Embedded Memory  Approximately 391 Mbits of on-chip RAM for data buffering, packet processing, or storage of intermediate results without external memory.
• I/O Density  702 I/O pins support broad external connectivity and interface aggregation for multi-channel or multi-protocol systems.
• Package and Mounting  Available in a 2104-FCBGA (47.5 × 47.5) supplier package and listed as 2104-BBGA, FCBGA package case; surface-mount mounting type for board-level integration.
• Power Supply  Operates with a supply range of 698 mV to 742 mV as specified for core power rails.
• Temperature and Grade  Extended grade device with an operating temperature range of 0°C to 110°C for applications that require elevated-temperature operation.
• Environmental Compliance  RoHS compliant to meet typical regulatory requirements for lead-free assembly.

Typical Applications

• High-density logic systems  Use the large logic element count to implement complex state machines, custom datapaths, and parallel processing pipelines on a single FPGA.
• Memory-intensive designs  Leverage approximately 391 Mbits of embedded memory for on-chip buffering, lookup tables, and temporary data storage to reduce external memory dependence.
• High I/O aggregation  Employ 702 I/Os to consolidate multiple interfaces or channels, enabling broad connectivity to sensors, transceivers, and peripherals.
• Board-level integration  Surface-mount 2104-FCBGA packaging supports compact, high-density PCB layouts for system integration.

Unique Advantages

• Large programmable fabric: Approximately 2,586,150 logic elements allow implementation of sizeable custom logic blocks without partitioning across multiple devices.
• Substantial embedded memory: Approximately 391 Mbits of on-chip RAM reduces dependence on external memory and simplifies memory hierarchy design.
• High I/O count: 702 I/Os simplify board routing for multi-channel systems and reduce the need for additional expansion devices.
• Extended temperature capability: Rated 0°C to 110°C and designated Extended grade to support applications requiring operation above standard commercial temperatures.
• Surface-mount FCBGA package: 2104-FCBGA (47.5 × 47.5) package enables dense PCB integration while providing the required pin count and signal routing density.
• Regulatory readiness: RoHS compliance supports lead-free manufacturing processes and environmental requirements.

Why Choose XCVU9P-L2FLGB2104E?

XCVU9P-L2FLGB2104E positions itself as a high-capacity, integration-focused FPGA offering a combination of large logic resources, significant embedded memory, and broad I/O connectivity in a 2104-FCBGA surface-mount package. The Extended grade operating range and RoHS compliance make it suitable for designs that demand elevated-temperature operation and lead-free assembly.

This part is well suited for engineering teams and procurement looking for a scalable programmable platform capable of consolidating complex logic, substantial on-chip storage, and high pin count connectivity into a single device footprint.

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