XCVU9P-3FSGD2104E

The XCVU9P-3FSGD2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC supplied in a 2104-FCBGA (47.5×47.5 mm) package. It delivers a high on-chip resource set including logic, embedded memory, and I/O density for designs requiring substantial programmable logic capacity.

Key on-chip resources include 2,586,150 logic elements, approximately 391 Mbits of embedded memory, and 676 user I/O pins. The device is offered in an extended grade with a specified operating range of 0 °C to 100 °C and supports a core voltage supply range of 873 mV to 927 mV.

Key Features

• Core Logic — Provides 2,586,150 logic elements for large-scale programmable logic implementation and complex digital designs.
• Embedded Memory — Approximately 391 Mbits of on-chip RAM to support buffering, large lookup tables, and data storage within the FPGA fabric.
• I/O Density & Package — 676 I/O pins in a 2104-FCBGA (47.5×47.5 mm) package, enabling extensive external connectivity in a surface-mount form factor.
• Power Supply — Operates with a core voltage supply between 873 mV and 927 mV, allowing designers to plan power delivery and regulation precisely.
• Thermal and Grade — Extended grade device with an operating temperature range of 0 °C to 100 °C suitable for temperature-controlled or commercial environments.
• Regulatory Compliance — RoHS compliant, meeting common environmental directives for lead-free assembly.

Unique Advantages

• High logic capacity: 2,586,150 logic elements enable implementation of complex algorithms and large-scale digital systems without external logic expansion.
• Substantial embedded memory: Approximately 391 Mbits of on-chip RAM reduces dependency on external memory for many buffering and storage needs, simplifying board design.
• Extensive I/O in a single package: 676 I/O pins in a 2104-FCBGA package support rich peripheral and high-pin-count interfaces while maintaining a single-package solution.
• Clear power envelope: Specified core voltage range of 873 mV to 927 mV helps streamline power-supply selection and validation during design.
• Commercial-grade operating range: Extended grade and 0 °C to 100 °C operating temperature provide predictable behavior across typical commercial thermal conditions.
• RoHS compliance: Facilitates lead-free assembly and helps meet common environmental requirements for modern electronics manufacturing.

Why Choose XCVU9P-3FSGD2104E?

The XCVU9P-3FSGD2104E positions itself as a high-capacity Virtex® UltraScale+™ FPGA option for designs that require a combination of large logic resources, significant embedded memory, and many I/O connections in a single surface-mount package. Its extended grade and defined supply and temperature parameters allow engineering and procurement teams to plan power delivery and thermal management with clear, verifiable specifications.

This device is well suited to projects where on-chip integration and predictable electrical/thermal requirements matter. The combination of logic density, embedded memory size, and I/O count delivers long-term design flexibility and scalability within the Virtex® UltraScale+™ family framework.

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