XCVU9P-3FLGA2104E

The XCVU9P-3FLGA2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD. It integrates 2,586,150 logic elements with approximately 391 Mbits of embedded memory and 832 I/Os in a 2104-FCBGA package to support high-density programmable logic and complex I/O requirements.

Designed for surface-mount deployment and RoHS-compliant production, this device provides a combination of large logic capacity, substantial on-chip memory, and a compact 2104-FCBGA (47.5 × 47.5 mm) footprint.

Key Features

• Core Logic  2,586,150 logic elements provide extensive programmable resources for complex digital designs.
• Configurable Logic Blocks (CLBs)  147,780 CLBs for structured logic implementation and resource partitioning.
• Embedded Memory  Approximately 391 Mbits of on-chip RAM to support large buffers, tables, and memory-intensive functions.
• I/O Density  832 I/Os to accommodate extensive external interfaces and high-pin-count connectivity requirements.
• Package  2104-BBGA / 2104-FCBGA package (47.5 × 47.5 mm) for high-density board integration and system-level routing.
• Power Supply Range  Core voltage supply specified at 873 mV to 927 mV to define operating power requirements.
• Temperature and Grade  Extended grade with an operating temperature range of 0°C to 100°C for deployment in temperature-controlled environments.
• Mounting and Compliance  Surface mount device with RoHS compliance for environmentally regulated manufacturing.

Typical Applications

• High-density digital processing  Large logic and memory resources enable data-path acceleration, complex state machines, and custom processing engines.
• Complex I/O interfacing  High I/O count supports multi-channel data acquisition, protocol bridging, and dense connector interfaces.
• System prototyping and validation  Extensive programmable resources allow system architects to prototype large-scale FPGA-based designs and validate hardware/software integration.

Unique Advantages

• High logic capacity: 2,586,150 logic elements deliver the resource headroom for large or partitioned designs.
• Substantial on-chip memory: Approximately 391 Mbits of embedded RAM reduces dependency on external memory for buffering and lookup tables.
• Extensive I/O availability: 832 I/Os simplify board-level connectivity and support multiple parallel interfaces without external multiplexing.
• Compact high-pin-count package: The 2104-FCBGA (47.5 × 47.5 mm) package balances pin density with a manageable PCB footprint.
• Defined power envelope: Core supply range of 873 mV to 927 mV provides clear parameters for power delivery design.
• RoHS-compliant manufacturing: Meets environmental compliance requirements for modern electronics production.

Why Choose XCVU9P-3FLGA2104E?

The XCVU9P-3FLGA2104E positions itself as a high-capacity, highly integrated FPGA solution for designs demanding extensive logic, memory, and I/O resources. Its combination of 2,586,150 logic elements, approximately 391 Mbits of embedded memory, and 832 I/Os in a 2104-FCBGA package makes it suitable for complex digital systems and dense interface implementations.

Engineers and procurement teams benefit from clear electrical and thermal boundaries—873 mV to 927 mV core supply and a 0°C to 100°C operating range—alongside RoHS compliance and surface-mount packaging for streamlined manufacturing and board integration.

Request a quote or submit an inquiry to obtain pricing, availability, and configuration support for the XCVU9P-3FLGA2104E.