XCVU9P-2FSGD2104E

The XCVU9P-2FSGD2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) from AMD designed for high-density, configurable logic implementations. It delivers large on-chip logic capacity, significant embedded memory, and a high I/O count in a compact FCBGA package for demanding digital designs.

Key hardware attributes include 2,586,150 logic elements, approximately 391 Mbits of embedded memory, 676 I/O pins, a 2104-FCBGA (47.5×47.5 mm) surface-mount package, an extended-grade operating range of 0 °C to 100 °C, and a supply voltage range of 825 mV to 876 mV. The device is RoHS compliant.

Key Features

• Core Logic  The device provides 2,586,150 logic elements to implement large-scale digital logic and complex programmable functions.
• Embedded Memory  Approximately 391 Mbits of on-chip RAM for buffering, lookup tables, and state storage within the FPGA fabric.
• I/O Capacity  676 I/O pins to support extensive external interfacing and high-pin-count system connections.
• Power  Operates with a core supply voltage range of 825 mV to 876 mV to match system power requirements.
• Package & Mounting  2104-FCBGA (47.5×47.5 mm) package, surface-mount mounting for high-density board integration.
• Operating Range & Grade  Extended-grade device rated for 0 °C to 100 °C operation.
• Compliance  RoHS compliant to meet lead-free and environmental standards.

Unique Advantages

• High logic density: 2,586,150 logic elements enable implementation of large, complex designs on a single device, reducing system partitioning.
• Substantial on-chip memory: Approximately 391 Mbits of embedded RAM support large buffering, data storage, and memory-intensive algorithms without external memory.
• Extensive I/O: 676 I/O pins provide flexibility for interfacing with multiple peripherals, buses, and high-pin-count connectors.
• Compact FCBGA package: 2104-FCBGA (47.5×47.5 mm) delivers high integration in a space-efficient, surface-mount form factor.
• Extended operating range: Rated 0 °C to 100 °C for applications requiring a wider commercial temperature envelope.
• Manufacturer backing: Produced by AMD, offering a recognized supplier for programmable logic devices.

Why Choose XCVU9P-2FSGD2104E?

The XCVU9P-2FSGD2104E positions itself as a high-capacity, highly integrated FPGA suitable for designs that require large logic resources, significant embedded memory, and a high number of I/O connections in a compact package. Its extended temperature rating and RoHS compliance make it suitable for a range of commercial and extended-temperature applications.

Choose this part when you need a single-device solution that combines substantial on-chip RAM, broad I/O capability, and dense logic capacity to simplify board-level design, reduce external component count, and support scalable digital system implementations.

Request a quote or submit an inquiry today to discuss availability, pricing, and how the XCVU9P-2FSGD2104E can meet your project requirements.