XCVU9P-2FLGB2104E

The XCVU9P-2FLGB2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, delivered in a high-pin-count FCBGA package. It integrates large on-chip memory, millions of logic elements and extensive I/O to support high-density, high-capacity programmable logic implementations.

With an extended grade and surface-mount 2104-FCBGA package, this device targets designs that require substantial logic resources, significant embedded memory, and broad connectivity within a constrained board footprint.

Key Features

• Logic Capacity Approximately 2,586,150 logic elements and 147,780 configurable logic blocks (CLBs) to implement complex, high-density logic designs.
• Embedded Memory Approximately 391 Mbits of on-chip RAM for data buffering, packet/storage staging, and architecture-level memory needs.
• I/O Resources 702 I/O pins to support wide parallel interfaces, multi-channel connectivity, and extensive board-level integration.
• Package and Mounting 2104-FCBGA package (47.5 × 47.5 mm) in a 2104-BBGA/FCBGA format, designed for surface-mount assembly to simplify PCB integration.
• Power Core voltage supply range of 0.825 V to 0.876 V, enabling specification-aligned power provisioning for the device.
• Temperature & Grade Extended grade operation with an operating temperature range of 0 °C to 100 °C suitable for many commercial and demanding deployments.
• Regulatory Compliance RoHS compliant to support lead-free manufacturing and regulatory requirements.

Typical Applications

• High-density logic implementation Large-scale FPGA designs that require millions of logic elements for custom compute or parallel processing architectures.
• On-chip buffering and streaming Designs that require substantial embedded memory for data buffering, packet handling, or real-time data staging.
• Multi-interface connectivity Systems needing hundreds of I/O signals for broad peripheral, sensor, or board-level interconnects.

Unique Advantages

• Massive logic resources: Millions of logic elements and tens of thousands of CLBs enable complex, high-density designs without external programmable logic expansion.
• Large embedded memory: Approximately 391 Mbits of on-chip RAM reduces dependence on external memory for many buffering and streaming tasks.
• Extensive I/O count: 702 I/O pins provide flexibility for multi-channel connectivity, high-parallelism interfaces, and board-level integration.
• Compact, high-pin package: The 2104-FCBGA (47.5 × 47.5 mm) package offers a high I/O density in a surface-mount form factor for streamlined PCB layouts.
• Controlled power envelope: Defined core voltage range (0.825–0.876 V) supports predictable power delivery design and verification.
• Extended-grade reliability: Extended grade rating and 0 °C to 100 °C operating range for deployments that require a wider commercial temperature window.

Why Choose XCVU9P-2FLGB2104E?

The XCVU9P-2FLGB2104E delivers a blend of very high logic density, substantial embedded memory and broad I/O that helps consolidate functionality into a single FPGA device. Its extended grade rating, defined core voltage range and surface-mount 2104-FCBGA package make it suitable for complex designs that demand integration, predictable power requirements and large on-chip resources.

As a Virtex® UltraScale+™ device from AMD, it is positioned for design teams that require scalable logic capacity, extensive on-chip memory, and high I/O counts to simplify system architecture and reduce external component needs.

Request a quote or submit a pricing inquiry today to evaluate the XCVU9P-2FLGB2104E for your next high-density FPGA design.