XCVU9P-2FLGC2104I

The XCVU9P-2FLGC2104I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) in a 2104-FCBGA package, designed for industrial-grade applications. It provides extensive logic capacity, substantial embedded memory, and a large I/O count to support complex, high-density digital designs.

With an operating temperature range of -40°C to 100°C and RoHS compliance, this device is specified for deployments that require robust environmental tolerance and regulatory conformance.

Key Features

• Logic Capacity — 2,586,150 logic elements to support large-scale designs with extensive combinational and sequential logic resources.
• Embedded Memory — Approximately 391 Mbits of on-chip RAM for buffering, frame storage, and data-path implementations.
• I/O — 416 user I/O pins to accommodate broad interfacing needs with external devices and subsystems.
• Package — 2104-FCBGA package (47.5 × 47.5 mm) providing a high-density ball-grid array for compact board integration.
• Power — Specified supply range from 825 mV to 876 mV, enabling designs with precise core-voltage planning.
• Temperature and Grade — Industrial-grade device rated for operation from -40°C to 100°C.
• Mounting — Surface mount package suitable for standard PCB assembly processes.
• Compliance — RoHS-compliant for environmental regulatory requirements.

Typical Applications

• High-density digital systems — Use the large logic element count and on-chip RAM for complex state machines, datapaths, and custom compute engines.
• Prototyping and platform development — Provide capacity and I/O count suitable for FPGA-based prototypes and hardware validation platforms.
• Industrial control and automation — Industrial temperature rating and robust I/O enable deployment in factory automation and process control equipment.

Unique Advantages

• Substantial logic resources: 2.6M logic elements allow consolidation of multiple functions into a single device, reducing board-level BOM and interconnect complexity.
• Significant embedded memory: Approximately 391 Mbits of on-chip RAM supports large buffers and high-throughput data processing without external memory dependency.
• Generous I/O count: 416 I/Os simplify integration with peripherals, sensors, and high-speed interfaces without requiring external I/O expanders.
• Industrial operating range: Rated from -40°C to 100°C to suit a wide range of deployment environments and long-term reliability needs.
• High-density package: 2104-FCBGA (47.5 × 47.5 mm) offers a compact footprint for designs that need maximum logic in a constrained PCB area.
• Regulatory readiness: RoHS compliance supports environmentally conscious product design and supply-chain requirements.

Why Choose XCVU9P-2FLGC2104I?

The XCVU9P-2FLGC2104I delivers a combination of large logic capacity, substantial embedded memory, and a high I/O count in a single industrial-grade FCBGA package. This makes it well suited to designers and engineers building complex digital systems, FPGA-based prototypes, and industrial control platforms that require on-chip resources and environmental robustness.

Its specified supply and temperature ranges, together with RoHS compliance, provide predictable integration characteristics and regulatory alignment for long-term deployments. Choose this part when a high-density, dependable FPGA fabric is required for scalable, board-level system designs.

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