XCVU9P-2FLGB2104I

The XCVU9P-2FLGB2104I is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC designed for high-density programmable logic and embedded memory integration. It combines a large logic resource pool with substantial on-chip RAM and a high I/O count to address complex digital designs.

This industrial-grade device supports operation from -40 °C to 100 °C, a core supply range of 825 mV to 876 mV, and comes in a 2104-FCBGA package (47.5 × 47.5 mm), making it suitable for systems that require significant logic capacity, large embedded memory, and extensive I/O in a surface-mount form factor.

Key Features

• Core Logic  Approximately 2,586,150 logic elements (cells) to implement complex digital functions and large-scale programmable logic designs.
• Embedded Memory  Approximately 391 Mbits of on-chip RAM for buffering, FIFOs, and on-device data storage to support memory-intensive processing.
• I/O Capacity  702 I/O pins to support dense external connectivity and multiple interface requirements in a single device.
• Power  Core voltage supply specified at 825 mV to 876 mV to match system power design requirements.
• Package & Mounting  2104-FCBGA (47.5 × 47.5 mm) package, 2104-BBGA FCBGA package case, intended for surface-mount assembly.
• Temperature & Grade  Industrial grade device rated for operation from -40 °C to 100 °C.
• Compliance  RoHS compliant.

Typical Applications

• Industrial control and automation  Leverages industrial temperature range and high logic capacity for complex control algorithms and real-time processing in harsh environments.
• Memory‑intensive processing  Uses the approximately 391 Mbits of embedded memory for buffering and data-path implementations in signal processing and data aggregation tasks.
• I/O‑dense system integration  Employs up to 702 I/O pins for multi-interface bridging, data acquisition, and systems that require extensive external connectivity.
• Prototyping and platform development  Provides large programmable resources and a common FCBGA package for building and validating complex digital systems.

Unique Advantages

• Highly integrated logic and memory: The combination of roughly 2.59 million logic elements and ~391 Mbits of embedded RAM enables consolidation of multiple functions on a single device.
• Extensive I/O capability: 702 I/O pins reduce the need for external multiplexing or expansion components when interfacing with numerous peripherals or subsystems.
• Industrial temperature rating: Certified operation from -40 °C to 100 °C supports deployment in industrial environments where wider temperature tolerance is required.
• Compact, surface-mount FCBGA package: The 2104-FCBGA (47.5 × 47.5 mm) package provides a high-density solution suitable for modern PCB layouts.
• Low-voltage core profile: A defined core supply range (825 mV–876 mV) enables deterministic power design and integration with system power rails.
• RoHS compliant: Meets lead-free and restricted substance requirements for regulatory and manufacturing consistency.

Why Choose XCVU9P-2FLGB2104I?

The XCVU9P-2FLGB2104I positions itself as a high-density, industrial-grade FPGA option for designs that demand large programmable logic resources, substantial on-chip memory, and extensive I/O in a single surface-mount package. Its specified operating temperature range and RoHS compliance make it suitable for long-lived industrial applications.

This device is well suited to system architects and OEMs designing complex digital systems that benefit from consolidation of functions, reduced external BOM, and a known power and thermal envelope. Its combination of resources supports scalable designs where logic capacity, embedded memory, and I/O count are primary selection criteria.

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