XCVU9P-L2FLGA2577E

The XCVU9P-L2FLGA2577E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) from AMD. It delivers a large programmable fabric with more than 2.5 million logic elements and substantial on-chip memory, packaged in a 2577‑FCBGA (52.5 × 52.5 mm) surface-mount package.

Designed for applications that require high logic capacity and sizable embedded RAM, this extended‑grade FPGA supports operation across a 0 °C to 110 °C temperature range and is RoHS compliant.

Key Features

• Programmable Logic Capacity — 2,586,150 logic elements to implement large, complex digital designs and parallel processing architectures.
• Embedded Memory — Approximately 391 Mbits of on‑chip RAM for buffering, data storage, and memory‑intensive algorithms.
• I/O Resources — 448 user I/O pins to support wide peripheral and interface connectivity within a single device.
• Package and Mounting — 2577‑FCBGA (2577‑BBGA) package in a 52.5 × 52.5 mm footprint, designed for surface‑mount PCB assembly.
• Power — Core supply voltage specified between 698 mV and 742 mV for the programmable fabric.
• Temperature and Grade — Extended grade with an operating range of 0 °C to 110 °C for environments requiring wider thermal tolerance than commercial grade.
• Compliance — RoHS compliant, facilitating use in lead‑free production environments.

Typical Applications

• High‑density digital processing — Large logic capacity and embedded RAM support compute‑intensive tasks and custom accelerators.
• Data buffering and packet processing — Significant on‑chip memory enables high‑throughput buffering and streaming data operations.
• Multi‑interface systems — Hundreds of I/O pins allow consolidation of multiple interfaces and peripherals on a single device.

Unique Advantages

• Massive logic resources: 2,586,150 logic elements allow implementation of complex functions and parallel datapaths without resorting to multiple devices.
• Substantial embedded memory: Approximately 391 Mbits of RAM reduces external memory requirements and simplifies board design.
• High I/O count: 448 I/O pins provide flexibility for dense connectivity and system integration.
• Extended thermal range: Rated 0 °C to 110 °C to meet applications that need broader operating temperature margins.
• Compact FCBGA package: 2577‑FCBGA (52.5 × 52.5 mm) provides a high‑density footprint for complex systems in a single package.
• RoHS compliant: Supports lead‑free manufacturing and regulatory requirements.

Why Choose XCVU9P-L2FLGA2577E?

The XCVU9P-L2FLGA2577E combines extensive logic resources, large embedded memory, and a high I/O count in a single extended‑grade FCBGA package, making it well suited for designs that demand high integration and significant on‑chip capacity. Its specified core voltage range and operating temperature envelope provide clear, verifiable design parameters for power and thermal planning.

This device is a practical choice for engineering teams building large, memory‑rich programmable systems that benefit from consolidating functions into a single FPGA to reduce board complexity and component count.

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