XCVU9P-L2FLGC2104E

The XCVU9P-L2FLGC2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) in a 2104-FCBGA package. It provides a combination of high logic density, substantial on-chip memory, and a large I/O count for designs that require extensive programmable fabric and connectivity.

This surface-mount, extended-grade device is intended for applications that can leverage its 147,780 CLBs, approximately 391 Mbits of embedded memory, and 416 user I/O pins, while operating within a 0 °C to 110 °C temperature range and a core supply of 698 mV to 742 mV.

Key Features

• Logic Fabric  147,780 CLBs and 2,586,150 logic elements provide high programmable logic capacity for complex digital designs.
• Embedded Memory  Approximately 391 Mbits of on-chip RAM to support large buffers, FIFOs, and memory-intensive functions without external memory.
• I/O and Connectivity  416 user I/O pins support dense external interfacing and signal routing in high-pin-count systems.
• Package and Mounting  2104-FCBGA (47.5 × 47.5 mm) package in a surface-mount form factor for compact board integration and high pin density.
• Power Supply  Core voltage supply range of 698 mV to 742 mV to match system power delivery design constraints.
• Operating Range and Grade  Extended grade device with an operating temperature range of 0 °C to 110 °C for deployment in a wide range of commercial and industrial environments.
• Compliance  RoHS compliant.

Typical Applications

• Memory‑intensive systems  Designs requiring large on-chip RAM capacity for buffering, packet processing, or data path acceleration can leverage approximately 391 Mbits of embedded memory.
• I/O‑heavy platforms  Systems needing extensive external connectivity benefit from 416 user I/O pins for sensors, transceivers, and peripheral interfaces.
• High‑density logic implementations  Applications that demand significant programmable logic resources can use the 2,586,150 logic elements and 147,780 CLBs for complex custom logic and control functions.
• Compact board designs  The 2104-FCBGA package and surface-mount mounting enable integration into space-constrained, high-pin-count PCBs.

Unique Advantages

• High programmable capacity: Over two million logic elements and 147,780 CLBs enable implementation of large-scale custom logic without immediate need for multiple devices.
• Substantial on‑chip RAM: Approximately 391 Mbits of embedded memory reduces reliance on external memory, simplifying BOM and board layout for many applications.
• Extensive I/O availability: 416 I/O pins provide flexibility for interfacing with numerous peripherals and high-density connectors.
• Surface-mount, high‑pin-count package: The 2104-FCBGA (47.5 × 47.5 mm) package offers a compact solution for designs requiring many signals in a single device footprint.
• Extended operating range: 0 °C to 110 °C rating supports deployment across a wide range of environmental conditions common in commercial and industrial equipment.
• RoHS compliant: Meets lead-free and restricted-substance requirements for modern manufacturing processes.

Why Choose XCVU9P-L2FLGC2104E?

The XCVU9P-L2FLGC2104E positions itself as a high-density, feature-rich FPGA option within the Virtex UltraScale+ family, offering a blend of massive logic capacity, significant embedded memory, and ample I/O in a compact FCBGA package. Its extended-grade temperature rating and RoHS compliance make it suitable for demanding commercial and industrial applications that require reliable, high-capacity programmable logic.

This device is suited for designers and development teams building complex, I/O-rich systems that need on-chip memory and large programmable fabric in a single-package solution, helping reduce board-level complexity and component count.

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