XCVU29P-3FSGA2577E

The XCVU29P-3FSGA2577E is a Virtex® UltraScale+™ FPGA offering high-capacity programmable logic and on-chip memory in a 2577-FCBGA package. It provides a combination of large logic resources, extensive I/O, and a defined operating and supply range for demanding system designs.

Key device metrics include 3,780,000 logic elements, approximately 99 Mbits of embedded memory, and 448 user I/Os, making this FPGA suitable for designs requiring high logic density and substantial on-chip RAM.

Key Features

• Core Logic — 216,000 CLBs delivering 3,780,000 logic elements to support large-scale programmable logic implementations.
• Embedded Memory — Approximately 99 Mbits of on-chip RAM (99,090,432 bits) for buffering, FIFO, and memory-intensive logic functions.
• I/O Capacity — 448 user I/Os to interface with high-pin-count systems and external peripherals.
• Package & Mounting — 2577-FCBGA (52.5 × 52.5 mm) BGA package, surface-mount for board-level integration.
• Power — Core voltage supply range of 825 mV to 876 mV; allows precise power provisioning aligned with system design needs.
• Temperature & Grade — Extended grade device specified for operation from 0°C to 100°C.
• Compliance — RoHS compliant for environmental requirements in lead-free assemblies.

Typical Applications

• Large-scale programmable logic designs — Use the extensive CLB and logic element resources for complex state machines, custom datapaths, and wide parallel processing logic.
• High-capacity on-chip memory use — Leverage approximately 99 Mbits of embedded RAM for buffering, packet queues, and memory-intensive algorithms.
• High-pin-count interfacing — 448 I/Os enable connectivity to multiple high-speed peripherals, mezzanine modules, or dense board-level I/O fabrics.

Unique Advantages

• Massive logic resources: 3,780,000 logic elements and 216,000 CLBs reduce the need for multi-FPGA partitioning in complex designs.
• Significant on-chip RAM: Approximately 99 Mbits of embedded memory supports large buffering and local data storage without external memory dependency.
• High I/O count: 448 user I/Os simplify board routing and reduce external bridging components for dense interface requirements.
• Robust packaging: 2577-FCBGA (52.5 × 52.5 mm) provides a high-pin-count, board-mountable form factor for advanced system integration.
• Defined power and thermal envelope: Clear core voltage range (825 mV–876 mV) and operating temperature (0°C–100°C) enable predictable power and thermal planning.
• Environmental compliance: RoHS status supports lead-free manufacturing and regulatory alignment.

Why Choose XCVU29P-3FSGA2577E?

The XCVU29P-3FSGA2577E positions itself as a high-density, high-memory FPGA solution within the Virtex® UltraScale+™ family, offering a combination of extensive logic elements, substantial embedded RAM, and a large number of I/Os in a single 2577-FCBGA package. Its specified voltage supply and extended temperature range make it suitable for system designs that require predictable power and thermal behavior.

This device is well suited for engineers and teams tackling large, memory-intensive FPGA designs that benefit from consolidation of logic and memory into a single device, simplifying board-level architecture and reducing BOM complexity.

If you would like pricing, lead-time, or availability information for XCVU29P-3FSGA2577E, request a quote or submit an inquiry today to receive a formal quotation and support for your design requirements.