XCVU29P-2FSGA2577E

The XCVU29P-2FSGA2577E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD. It delivers high logic density and system integration in a 2577-FCBGA package for designs that require large on-chip memory, extensive I/O, and low-voltage core operation.

Targeted at applications that demand programmable hardware capacity and flexible interfacing, this extended-grade FPGA combines substantial logic resources with abundant embedded memory and I/O to support complex digital designs.

Key Features

• Logic Capacity  Approximately 3,780,000 logic elements for implementing complex programmable logic and custom hardware functions.
• Embedded Memory  Approximately 99 Mbits of embedded memory to support on-chip buffering, lookup tables, and state storage.
• I/O Resources  448 general-purpose I/O pins to enable wide interfacing with peripherals, memory, and high-speed interfaces.
• Power and Voltage  Core supply range from 825 mV to 876 mV, allowing precise low-voltage operation consistent with modern FPGA power architectures.
• Package and Mounting  2577-BBGA / 2577-FCBGA surface-mount package (2577-FCBGA, 52.5 × 52.5) for high-density board integration.
• Operating Range  Extended-grade device with an operating temperature range of 0 °C to 100 °C for reliable performance in controlled-temperature environments.
• RoHS Compliance  RoHS-compliant construction for environmental regulatory adherence.

Typical Applications

• Custom Digital Acceleration  Use the large logic element count to implement hardware-accelerated algorithms and custom datapaths.
• Memory-Intensive Designs  Leverage approximately 99 Mbits of on-chip memory for buffering, caching, and stateful processing.
• High-Density I/O Integration  Deploy the 448 I/O pins for complex interface aggregation, bridging multiple peripherals and subsystems.

Unique Advantages

• High Logic Density: Approximately 3,780,000 logic elements enable large-scale custom logic integration on a single device.
• Significant On-Chip Memory: Approximately 99 Mbits of embedded memory reduces dependence on external RAM and lowers system latency.
• Extensive I/O Count: 448 I/Os simplify board-level routing for multi-channel interfaces and complex connectivity requirements.
• Compact FCBGA Package: 2577-FCBGA surface-mount package supports high-density PCB layouts while consolidating system functionality.
• Low-Voltage Core Operation: 825 mV to 876 mV supply range supports modern low-voltage power architectures and efficient core operation.
• Extended Temperature Grade: Rated for 0 °C to 100 °C operation to suit designs deployed in controlled industrial and commercial environments.

Why Choose XCVU29P-2FSGA2577E?

The XCVU29P-2FSGA2577E positions itself as a high-capacity FPGA option that brings together substantial logic resources, large embedded memory, and a high I/O count in a single 2577-FCBGA package. Its low-voltage core operation and extended temperature rating make it suitable for developers requiring scalable programmable logic with strong on-chip memory and interface capabilities.

This device is well suited for engineering teams building complex digital systems that benefit from on-device memory, dense logic implementation, and broad connectivity while maintaining RoHS compliance and a compact board footprint.

Request a quote or submit a product inquiry today to discuss pricing and availability for the XCVU29P-2FSGA2577E.