XCVU29P-1FIGD2104I

The XCVU29P-1FIGD2104I is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC designed for industrial-grade applications. It provides a high-density programmable fabric combined with substantial embedded memory and extensive I/O to support complex digital designs.

Key on-chip resources include 3,780,000 logic elements, approximately 99 Mbits of embedded RAM, and 676 I/O pins. The device is supplied in a 2104-FCBGA (52.5×52.5 mm) surface-mount package, operates from 825 mV to 876 mV, and is specified for operation from -40 °C to 100 °C. The part is RoHS compliant.

Key Features

• High-density logic: 3,780,000 logic elements to implement large-scale custom digital functions and complex datapaths.
• Embedded memory: Approximately 99 Mbits of on-chip RAM to support buffering, lookup tables, and temporary storage without relying on external memory.
• Extensive I/O: 676 I/O pins for broad connectivity to peripherals, transceivers, and external devices.
• Power supply range: Operates from 825 mV to 876 mV, enabling defined core-voltage integration within system power budgets.
• Package and mounting: 2104-FCBGA (52.5×52.5 mm) surface-mount package suitable for high-density PCB designs.
• Industrial temperature grade: Specified to operate from -40 °C to 100 °C for use in temperature-challenging environments.
• Environmental compliance: RoHS compliant to meet common regulatory procurement requirements.

Typical Applications

• Industrial control systems: Leverages industrial temperature range and high logic capacity for complex control, monitoring, and automation tasks.
• Custom FPGA-based designs: Supports large-scale custom logic implementations where extensive on-chip memory and I/O are required for prototyping or production.
• High-density embedded systems: Provides significant embedded RAM and I/O pin count for systems that need consolidated on-chip resources to reduce external components.

Unique Advantages

• High integration: Large logic element count and substantial embedded memory reduce the need for external logic and memory devices, simplifying BOM and board complexity.
• Wide I/O capability: 676 I/O pins enable broad interfacing options and flexible partitioning of signals across the FPGA fabric.
• Industrial robustness: Rated for -40 °C to 100 °C operation to support deployments in demanding environmental conditions.
• Precision core supply: Narrow supply range (825 mV–876 mV) helps maintain consistent core operation across production units.
• Surface-mount, high-density package: 2104-FCBGA (52.5×52.5 mm) package allows for compact PCB integration while accommodating the device's high resource count.
• Regulatory alignment: RoHS compliance streamlines procurement for assemblies requiring lead-free components.

Why Choose XCVU29P-1FIGD2104I?

The XCVU29P-1FIGD2104I positions itself as a high-capacity, industrial-grade FPGA option for designs that demand significant on-chip logic, memory, and I/O resources. Its combination of approximately 99 Mbits of embedded RAM, 3,780,000 logic elements, and 676 I/O pins supports consolidation of complex functions onto a single device.

With a 2104-FCBGA surface-mount package, a defined core voltage range, and an extended operating temperature window, this device delivers a scalable and robust platform for engineers building large custom FPGA systems in industrial environments.

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