XCVU27P-1FIGD2104E

The XCVU27P-1FIGD2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC in a 2104-FCBGA package. It provides very large logic capacity and embedded RAM for complex digital designs that require substantial on-chip resources.

Built for applications that demand high logic density and extensive embedded memory, this device combines 2,835,000 logic elements with approximately 74 Mbits of embedded memory, 676 I/O pins, and a compact 2104-FCBGA (52.5 × 52.5 mm) surface-mount package.

Key Features

• Core Logic  Approximately 2,835,000 logic elements for large-scale programmable logic implementation and complex system-on-chip functions.
• Logic Blocks  162,000 configurable logic blocks (CLBs) to structure and partition large designs efficiently.
• Embedded Memory  Approximately 74 Mbits of embedded RAM bits to support data buffering, on-chip storage, and memory-intensive algorithms.
• I/O Density  676 I/O pins to support extensive interfacing and parallel connectivity in dense system designs.
• Power  Specified core voltage supply range of 825 mV to 876 mV to match platform power-design requirements.
• Package  2104-FCBGA package (52.5 × 52.5 mm) in a surface-mount format for high-pin-count applications.
• Operating Range & Grade  Extended grade with an operating temperature range of 0 °C to 100 °C suitable for demanding commercial and industrial-adjacent environments.
• RoHS Compliance  RoHS-compliant manufacturing for environmentally conscious designs.

Typical Applications

• Large-scale FPGA-based Systems  Implement complex, high-density logic and control functions using millions of logic elements and extensive embedded RAM.
• Data Processing and Buffering  Leverage approximately 74 Mbits of on-chip memory for buffering, packet processing, and other memory-intensive tasks.
• High-Pin-Count Interface Modules  Utilize 676 I/O pins for extensive parallel interfaces and multi-channel connectivity in modular systems.

Unique Advantages

• Massive Logic Capacity:  Approximately 2.8 million logic elements enable consolidation of large functions onto a single device, reducing board-level complexity.
• Substantial On-Chip Memory:  Roughly 74 Mbits of embedded RAM support in-device data storage and reduce dependence on external memory components.
• High I/O Count:  676 I/O pins provide flexibility for dense interconnect and multi-channel designs without extensive external multiplexing.
• Compact High-Pin Package:  2104-FCBGA (52.5 × 52.5 mm) surface-mount package accommodates high pin count in a manufacturable form factor.
• Controlled Core Voltage Range:  Specified 825 mV to 876 mV supply range enables predictable power budgeting for platform design.
• Extended Operating Grade:  0 °C to 100 °C operating range supports deployment in environments requiring extended temperature tolerance.

Why Choose XCVU27P-1FIGD2104E?

The XCVU27P-1FIGD2104E delivers very large logic capacity and embedded memory within a high-pin-count 2104-FCBGA package, making it well suited for designs that consolidate multiple functions onto a single FPGA. Its combination of approximately 2,835,000 logic elements, around 74 Mbits of RAM, and 676 I/O offers a strong platform for complex digital systems that require on-chip resources and extensive interfacing.

With a defined core voltage range and an extended operating temperature grade, this device fits designs that require predictable power characteristics and extended temperature tolerance while maintaining RoHS compliance.

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