XCVU23P-3VSVA1365E

The XCVU23P-3VSVA1365E is a Virtex® UltraScale+™ field programmable gate array packaged in a 1365-ball FCBGA. It delivers a large on-chip logic fabric and embedded memory suitable for designs that require extensive programmable logic, significant embedded RAM, and substantial I/O connectivity.

Targeted at designs that need high logic density and memory integration, the device combines 2,252,250 logic elements with approximately 78 Mbits of embedded memory and 364 I/O connections, all in a surface-mount 1365-FCBGA (35×35) package.

Key Features

• Logic Capacity — 2,252,250 logic elements (cells) provide extensive programmable fabric for complex digital designs and custom logic implementations.
• Embedded Memory — Approximately 78 Mbits of on-chip RAM support large buffering, caching, and data-path implementations without external memory dependence.
• I/O Connectivity — 364 I/O pins enable broad external interfacing for multi-channel communication, sensor arrays, and system integration.
• Package and Mounting — Available in a 1365-BFBGA / 1365-FCBGA (35×35) surface-mount package suitable for board-level integration where a high-pin-count BGA is required.
• Power Supply Range — Specified core voltage supply range of 873 mV to 927 mV to match system power-rail planning and regulation requirements.
• Operating Conditions — Extended-grade device with an operating temperature range of 0 °C to 100 °C and RoHS compliance for environmental requirements.

Typical Applications

• High-density logic designs — Implement complex state machines, wide datapaths, and large-scale custom logic using the extensive logic element count.
• Memory-intensive processing — Use the approximately 78 Mbits of embedded RAM for packet buffering, frame storage, or intermediate data staging without relying solely on external memory.
• Multi-interface systems — Leverage 364 I/O pins to connect multiple high-pin-count interfaces, sensors, or parallel data lanes on a single FPGA.
• Board-level production systems — The 1365-FCBGA (35×35) surface-mount package suits compact, high-density PCB designs requiring robust BGA mounting.

Unique Advantages

• Large programmable fabric: 2,252,250 logic elements enable substantial integration of custom logic, reducing the need for additional discrete devices.
• Significant on-chip memory: Approximately 78 Mbits of embedded RAM supports larger on-chip data structures and lowers external memory bandwidth demands.
• High I/O count: 364 I/O connections provide flexibility to interface with numerous peripherals and parallel data channels directly.
• Board-level-ready package: 1365-FCBGA (35×35) packaging delivers high pin density in a standard BGA form factor for streamlined PCB design.
• Designed for extended environments: Extended-grade specification and an operating range of 0 °C to 100 °C support a wide set of deployment scenarios.
• Regulatory compliance: RoHS-compliant manufacturing supports environmental and materials planning for product lifecycles.

Why Choose XCVU23P-3VSVA1365E?

The XCVU23P-3VSVA1365E positions itself as a high-density, memory-rich FPGA solution in a compact 1365-FCBGA package. Its combination of 2,252,250 logic elements, approximately 78 Mbits of embedded RAM, and 364 I/O connections makes it suitable for engineers building complex digital systems that require extensive on-chip resources and broad external interfacing.

With an extended operating grade, defined voltage supply range, and RoHS compliance, this device offers a balance of integration and practical deployment characteristics for board- and system-level designs where large programmable capacity and embedded memory are primary considerations.

Request a quote or submit your procurement inquiry today to evaluate the XCVU23P-3VSVA1365E for your next high-density FPGA design.