XCVU27P-2FSGA2577E

The XCVU27P-2FSGA2577E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD, supplied in a 2577-FCBGA surface-mount package. It delivers very large programmable logic capacity, substantial embedded memory, and a high I/O count for designs that require broad on-chip resources.

With specifications including millions of logic elements, approximately 74.3 Mbits of on-chip RAM and 448 I/Os, this device is aimed at applications that need extensive programmable logic, dense memory resources, and significant external connectivity while operating within an extended-grade temperature range.

Key Features

• Core Logic Approximately 2,835,000 logic elements provide large-scale programmable fabric for complex digital designs.
• Logic Blocks 162,000 configurable logic blocks (CLBs) for fine-grained logic partitioning and implementation.
• Embedded Memory Approximately 74.3 Mbits of on-chip RAM to support large buffering, lookup tables, and state storage without external memory.
• I/O Capacity 448 I/Os to support extensive external interfaces, multi-channel connectivity, and board-level integration.
• Power Supply Range Core supply range of 825 mV to 876 mV suitable for the device’s specified operating conditions.
• Package 2577-BBGA / 2577-FCBGA surface-mount package (52.5 × 52.5 mm) that consolidates high-density routing and a compact board footprint.
• Temperature & Grade Extended-grade device with an operating temperature range of 0°C to 100°C for use in temperature-sensitive deployments.
• Regulatory Compliance RoHS compliant, meeting standard environmental requirements for lead-free assemblies.

Typical Applications

• Data Center Acceleration — Implements large custom accelerators and offload engines using extensive logic and on-chip memory to minimize external resources.
• Communications and Networking — Supports high-density interface and packet-processing functions with 448 I/Os for multi-channel connectivity.
• Video and Signal Processing — Provides the logic capacity and embedded RAM needed for complex pipelines, buffering and real-time processing.
• Prototyping and Complex SoC Emulation — Enables large-scale prototyping of system designs that require substantial programmable fabric and memory.

Unique Advantages

• High Logic Density: Approximately 2.8 million logic elements support complex, large-scale digital implementations without partitioning across multiple devices.
• Substantial Embedded Memory: Approximately 74.3 Mbits of on-chip RAM reduces dependence on external memory and simplifies board-level design.
• Extensive I/O Count: 448 I/Os enable broad external connectivity for multi-channel systems and high-pin-count interfaces.
• Compact, High-Pin Package: 2577-FCBGA (52.5 × 52.5 mm) consolidates dense routing and maintains a manageable board footprint.
• Extended-Grade Operation: Rated for 0°C to 100°C operation, providing support for applications that require extended temperature capability.
• RoHS Compliant: Meets lead-free assembly and environmental requirements for modern production.

Why Choose XCVU27P-2FSGA2577E?

The XCVU27P-2FSGA2577E combines very large programmable logic capacity, substantial embedded RAM, and a high I/O complement in a single, surface-mount 2577-FCBGA package. Its extended-grade operating range and defined core voltage supply make it suitable for designs that require scalable logic resources and dense on-chip memory while maintaining a compact board footprint.

This device is appropriate for engineers and teams building complex digital systems—such as accelerators, multi-channel communications engines, and high-performance signal processing chains—who need a high-integration FPGA platform with verifiable, on-device resources and RoHS compliance.

Request a quote or submit a product inquiry to obtain current pricing and availability for the XCVU27P-2FSGA2577E.