XCVU27P-3FIGD2104E

The XCVU27P-3FIGD2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC from AMD, supplied in a 2104-FCBGA package. It provides a very high density of programmable logic, embedded memory, and I/O for complex, high-capacity digital designs.

With millions of logic elements, tens of megabits of on-chip RAM and hundreds of I/O pins, this device targets applications requiring dense integration and significant on-chip resources while operating within a defined supply and temperature envelope.

Key Features

• High Logic Density  Approximately 2,835,000 logic elements enable implementation of very large, complex digital functions and extensive custom logic.
• Embedded Memory  Approximately 74.3 Mbits of on-chip RAM provide large, low-latency memory capacity for buffering, caching and intermediate data storage.
• Extensive I/O  676 user I/O pins support broad interfacing options for high-channel-count systems and multi‑lane connectivity.
• Package  2104-BBGA / 2104-FCBGA package (52.5 × 52.5 mm) delivers a high-pin-count, compact footprint suitable for dense PCB designs.
• Power Supply Range  Specified core voltage range of 825 mV to 876 mV for the device core supply.
• Operating Range & Mounting  Surface-mount device rated for 0 °C to 100 °C operating temperature and provided in an Extended grade.
• Environmental Compliance  RoHS compliant to support regulatory requirements for lead-free assembly.

Typical Applications

• High-density digital processing  Use the device’s large logic fabric and abundant on-chip RAM to implement complex custom processing pipelines and large-scale state machines.
• Data and packet handling  The high I/O count and embedded memory make it suitable for buffer‑intensive networking and data plane tasks that require many interfaces and local storage.
• Prototyping and custom hardware acceleration  Leverage the extensive logic resources and memory to prototype ASIC-level functions or accelerate compute kernels in hardware.

Unique Advantages

• Massive programmable capacity: Approximately 2.8 million logic elements enable integration of very large designs on a single device, reducing system-level component count.
• Significant on-chip memory: Roughly 74.3 Mbits of embedded RAM lowers external memory dependency and improves data locality for latency-sensitive functions.
• High I/O integration: 676 I/O pins support complex multi-channel interfaces and simplify board-level routing for dense systems.
• Compact, high-pin-count package: The 2104-FCBGA (52.5 × 52.5 mm) package balances footprint with connectivity to fit space-constrained, high-density PCBs.
• Designed for extended-temperature operation: Rated 0 °C to 100 °C and supplied in Extended grade to meet a broad set of commercial and industrial thermal profiles.
• Regulatory readiness: RoHS compliance supports lead‑free assembly processes and environmental regulations.

Why Choose XCVU27P-3FIGD2104E?

The XCVU27P-3FIGD2104E positions itself as a dense, resource-rich FPGA solution for engineers who need large programmable logic capacity, substantial embedded memory, and abundant I/O in a single component. Its combination of logic elements, on-chip RAM and high pin count helps consolidate functionality, reduce BOM complexity and enable compact system designs.

This device is well suited to teams developing complex digital systems, hardware accelerators, or multi-interface controllers that require scalable on-chip resources and predictable operating conditions. As an AMD Virtex® UltraScale+™ family product, it provides a high-density platform for designs that demand significant integration and on-board memory.

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