XCVU23P-2FSVJ1760I

The XCVU23P-2FSVJ1760I is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) in a 1760-FCBGA package. It provides a high density of programmable logic, substantial on-chip memory, and a large number of I/O pins in a surface-mount, industrial-grade package.

Key Features

• Logic Capacity  Approximately 2,252,250 logic elements for complex, high-density programmable logic designs.
• Embedded Memory  Approximately 78 Mbits of embedded memory (77,909,197 total RAM bits) to support buffering, look-up tables, and on-chip data storage.
• Configurable I/O  644 I/O pins to interface with multiple peripherals, sensors, and external devices.
• Package & Mounting  1760-FCBGA (1760-BBGA) package, 42.5 × 42.5 mm, surface-mount mounting for compact board-level integration.
• Power Domain  Specified supply voltage range of 825 mV to 876 mV to match targeted core-voltage requirements.
• Industrial Temperature Range  Rated for operation from −40 °C to 100 °C and designated as Industrial grade for thermally demanding environments.
• RoHS Compliant  Conforms to RoHS environmental requirements.

Unique Advantages

• High logic density: Large logic-element count enables implementation of complex algorithms and large FPGA designs on a single device.
• Significant on‑chip memory: Nearly 78 Mbits of embedded RAM reduces dependence on external memory for many buffering and data-path tasks.
• Extensive I/O capability: 644 I/Os provide flexibility for multi-interface designs and high pin-count system integration.
• Industrial reliability: Rated for −40 °C to 100 °C operation, suitable for systems requiring extended temperature performance.
• Compact, high‑pin package: 1760-FCBGA (42.5 × 42.5 mm) enables dense PCB layouts while providing a high pin count.
• Deterministic core supply: Narrow core voltage specification supports designs targeting a specific core power domain.

Why Choose XCVU23P-2FSVJ1760I?

The XCVU23P-2FSVJ1760I is positioned for designs that require high logic capacity, substantial embedded memory, and a large number of I/Os within an industrial temperature envelope. Its 1760-FCBGA package and surface-mount mounting make it suitable for compact, high-density board layouts where on-chip resources and reliability matter.

Choose this device when your design demands a combination of high integration, significant on-chip RAM, and extensive I/O connectivity while maintaining operation across industrial temperature ranges.

Request a quote or submit a pricing inquiry to get availability and lead-time information for the XCVU23P-2FSVJ1760I.