XCVU29P-2FSGA2577I

The XCVU29P-2FSGA2577I is a Virtex® UltraScale+™ field programmable gate array (FPGA) in a 2577-ball FCBGA package. It provides a high-density programmable logic fabric with extensive embedded memory and I/O for complex, resource-intensive designs.

This industrial-grade device is targeted at applications that require large logic capacity, substantial on-chip memory, and a broad voltage and temperature operating range for reliable deployment in demanding environments.

Key Features

• Logic Capacity  216,000 CLBs and 3,780,000 logic elements (cells) for implementing large-scale programmable logic and complex algorithms.
• Embedded Memory  Approximately 99 Mbits of on-chip RAM (99,090,432 bits) to support buffering, large lookup tables, and data storage within the FPGA fabric.
• I/O Resources  448 user I/O pins to support multi-channel interfaces and dense connectivity options.
• Power Supply Range  Designed for operation with a core voltage supply between 825 mV and 876 mV.
• Package and Mounting  2577-FCBGA package (52.5×52.5 mm) / 2577-BBGA; surface-mount mounting type for board-level integration.
• Industrial Temperature Grade  Rated for operation from -40 °C to 100 °C, suitable for industrial deployments.
• Environmental Compliance  RoHS-compliant to meet common lead-free assembly requirements.

Typical Applications

• High-density logic implementations  Use the large CLB count and extensive logic cells to consolidate complex digital functions into a single FPGA.
• Memory-intensive designs  Leverage approximately 99 Mbits of embedded RAM for on-chip buffering, packet storage, and data processing tasks.
• I/O-rich systems  Utilize 448 I/O pins to connect multiple peripherals, interfaces, and high-channel-count subsystems.
• Industrial equipment  Industrial-grade temperature range and RoHS compliance support deployment in industrial control and instrumentation environments.

Unique Advantages

• High logic density: The combination of 216,000 CLBs and 3,780,000 logic elements enables integration of complex functions and reduces the need for multiple devices.
• Significant on-chip memory: Approximately 99 Mbits of embedded RAM minimizes external memory dependence and improves data throughput for memory-bound tasks.
• Extensive I/O capacity: 448 I/O pins provide flexible connectivity for multi-channel and multi-protocol designs.
• Industrial operating range: -40 °C to 100 °C rating supports reliable operation across a wide range of environmental conditions.
• Board-level compatibility: Surface-mount 2577-FCBGA package (52.5×52.5 mm) simplifies integration into high-density PCB layouts.
• RoHS compliant: Aligns with lead-free manufacturing and environmental requirements.

Why Choose XCVU29P-2FSGA2577I?

The XCVU29P-2FSGA2577I delivers a balanced combination of large logic capacity, substantial embedded memory, and broad I/O resources in an industrial-grade FPGA package. These characteristics make it well suited for designs that require consolidation of complex digital functions and significant on-chip storage within a single device.

For engineering teams and procurement looking for a robust, high-capacity FPGA solution, this part offers scalability through its logic and memory resources and reliability through its industrial temperature rating and RoHS compliance.

Request a quote or submit a procurement inquiry to receive pricing and availability information for the XCVU29P-2FSGA2577I.