XCVU190-3FLGC2104E

The XCVU190-3FLGC2104E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) optimized for high-density, programmable digital designs. Built on the UltraScale™ family architecture, it provides a large pool of logic and embedded memory to support complex system implementations. Typical use cases include advanced digital signal processing, high-throughput data processing, and other applications that require a high count of programmable logic and on-chip memory while maintaining a compact FCBGA package footprint.

Key Features

• Core Logic  Approximately 2,349,900 logic elements provide a very large fabric for implementing complex combinational and sequential logic designs.
• Configurable Logic Blocks  A substantial logic resource count of 134,280 CLB-style elements supports large-scale parallelism and deep pipelining.
• Embedded Memory  Approximately 151 Mbits of on-chip RAM (150,937,600 bits) for buffering, caching, and on-chip data storage.
• I/O Capacity  416 I/O pins support flexible interfacing to external devices and subsystems.
• Power Domain  Core supply voltage range of 0.97 V to 1.03 V enabling defined power planning for system designs.
• Package & Mounting  2104-FCBGA package (47.5 × 47.5 mm) in a surface-mount form factor suitable for high-density board integration.
• Operating Conditions  Extended grade with an operating temperature range of 0 °C to 100 °C for deployment in a broad set of commercial and extended-temperature applications.
• RoHS Compliant  Meets RoHS requirements for lead-free manufacturing processes.

Typical Applications

• High-Performance Signal Processing  Leverages the large logic element count and substantial embedded memory to implement DSP pipelines, filters, and real-time data paths.
• Data Acceleration  Suitable for offload and acceleration tasks that need significant programmable logic and on-chip RAM for buffering and computation.
• Prototyping and Complex System Integration  Provides a high-density platform for integrating multiple functions—control, data movement, and custom logic—into a single programmable device.

Unique Advantages

• High Logic Density: Approximately 2.35 million logic elements enable large designs and extensive parallelism without external ASIC development.
• Substantial On-Chip Memory: ~151 Mbits of embedded RAM reduce reliance on external memory for many buffering and caching tasks, simplifying board-level design.
• Ample I/O Count: 416 I/O pins provide the connectivity required for complex multi‑device systems and high-bandwidth interfaces.
• Compact High-Pin Package: 2104-FCBGA (47.5 × 47.5 mm) delivers high integration density while remaining surface-mount friendly for modern PCB assembly.
• Controlled Core Power Range: Defined core voltage range (0.97 V–1.03 V) aids in predictable power budgeting and thermal planning.
• RoHS Compliant: Aligns with lead‑free manufacturing requirements to support modern production processes.

Why Choose XCVU190-3FLGC2104E?

The XCVU190-3FLGC2104E positions itself as a high-density, high-capacity FPGA solution within the Virtex® UltraScale™ family, balancing a very large logic element count with substantial embedded memory and extensive I/O. It is well suited for designers and systems that require significant on-chip resources to implement complex algorithms, real-time processing, and multi-function integration in a single programmable device.

With a surface-mount 2104-FCBGA package, defined core voltage range, extended-grade temperature capability, and RoHS compliance, this device offers a combination of scalability and practical system-level considerations for production and advanced prototyping projects.

Request a quote or submit a procurement inquiry today to evaluate XCVU190-3FLGC2104E for your next high-density FPGA design.