XCVU190-3FLGA2577E

The XCVU190-3FLGA2577E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC delivering very high programmable logic capacity and substantial on-chip memory in a 2577-ball FCBGA package. It provides a large number of logic elements and embedded RAM suited to designs that require dense programmable fabric and significant local memory resources.

With a supply range of 970 mV to 1.03 V, 448 I/O pins, and an operating temperature range of 0 °C to 100 °C, this extended-grade device addresses applications that need high integration and deterministic on-board resources in a surface-mount FCBGA form factor.

Key Features

• Programmable Logic Capacity Contains 2,349,900 logic elements to support large, complex FPGA designs and high-density logic implementation.
• Embedded Memory Approximately 150.9 Mbits of on-chip RAM to accommodate large buffering, lookup tables, and memory-intensive logic functions.
• I/O Density 448 configurable I/O pins for broad external connectivity and flexible interfacing to system peripherals and high-speed buses.
• Power Domain Core voltage range of 970 mV to 1.03 V, enabling operation within the specified power envelope for the device.
• Package and Mounting 2577-BBGA / 2577-FCBGA package (52.5×52.5 mm) in a surface-mount format for high-density board integration.
• Temperature and Grade Extended-grade device rated for operation from 0 °C to 100 °C, suitable for applications requiring this temperature specification.
• Compliance RoHS compliant, meeting environmental substance requirements for lead-free assembly processes.

Typical Applications

• High-density FPGA designs — Large-scale programmable systems that require millions of logic elements and extensive on-chip RAM to implement complex custom logic.
• Memory-intensive processing — Designs that leverage approximately 150.9 Mbits of embedded RAM for buffering, lookup tables, or local data storage.
• Interface consolidation — Systems that need a large number of I/O (448 pins) to aggregate, translate, or bridge multiple external interfaces on a single device.

Unique Advantages

• High logic density: 2,349,900 logic elements enable consolidation of large functions and reduce the need for multiple devices.
• Substantial on-chip RAM: Approximately 150.9 Mbits of embedded memory supports local data handling and reduces external memory dependency.
• Robust I/O count: 448 I/O pins provide flexibility for extensive external connectivity and system integration options.
• Compact package: 2577-FCBGA (52.5×52.5 mm) surface-mount package allows high-density board designs while accommodating the device’s resources.
• Extended temperature rating: 0 °C to 100 °C operational range addresses designs requiring this specific temperature envelope.
• RoHS compliant: Meets environmental regulations for lead-free manufacturing and assembly.

Why Choose XCVU190-3FLGA2577E?

The XCVU190-3FLGA2577E positions itself as a high-capacity Virtex® UltraScale™ FPGA option that balances extensive logic resources, significant embedded memory, and a large I/O complement in a single FCBGA package. Its specifications support designs that demand dense programmable fabric and on-chip RAM while maintaining a defined power and thermal operating window.

This device is suited for engineers and teams developing complex programmable systems who need a scalable, high-integration FPGA platform. The combination of logic capacity, memory, I/O density, and RoHS compliance provides a clear foundation for robust designs that plan for long-term deployment and integration into dense PCBs.

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