XCVU190-2FLGB2104I

The XCVU190-2FLGB2104I is a Virtex® UltraScale™ field programmable gate array (FPGA) IC from AMD. It delivers a large logic capacity and substantial on-chip memory combined with dense I/O in a 2104-ball FCBGA package, targeted at designs that require significant programmable logic, embedded RAM, and high I/O counts.

With an operating range from −40 °C to 100 °C and RoHS compliance, this industrial-grade device is specified for deployment where extended temperature range and environmental compliance are required.

Key Features

• Logic Capacity — Approximately 2,349,900 logic elements provide extensive programmable logic resources for complex digital designs.
• Embedded Memory — Approximately 150.9 Mbits of on-chip RAM support large buffering, caching, and data-path implementations without relying solely on external memory.
• I/O Density — 702 user I/O pins enable dense connectivity to peripherals, memory interfaces, and high-speed transceivers.
• Power Supply Range — Specified core supply range from 922 mV to 979 mV for precise power budgeting and board-level power design.
• Package and Mounting — Supplied in a 2104-FCBGA (47.5×47.5 mm) package case (2104-BBGA), optimized for surface-mount assembly in compact system layouts.
• Temperature Range — Rated for −40 °C to 100 °C operation to support industrial temperature environments.
• Industrial Grade and Compliance — Designated industrial grade and RoHS compliant for regulatory and environmental requirements.

Unique Advantages

• Large programmable fabric: Approximately 2.35 million logic elements enable consolidation of multiple functions into a single device, reducing system BOM and interconnect complexity.
• Substantial on-chip memory: Approximately 150.9 Mbits of embedded RAM permit significant local data storage for high-throughput data paths and buffering.
• High I/O count: 702 I/O pins allow flexible interfacing options and simplify routing of multiple peripherals or parallel data channels.
• Compact, manufacturable package: 2104-FCBGA (47.5×47.5 mm) surface-mount package supports high-density board designs while meeting standard assembly processes.
• Industrial temperature capability: −40 °C to 100 °C rating enables deployment in a wide range of temperature-challenging environments.
• Regulatory readiness: RoHS compliance supports environmental and materials requirements for commercial and industrial products.

Why Choose XCVU190-2FLGB2104I?

The XCVU190-2FLGB2104I positions itself as a high-capacity FPGA option combining millions of logic elements, roughly 151 Mbits of embedded memory, and hundreds of I/O in a single 2104-ball FCBGA package. Its industrial temperature rating and RoHS compliance make it suitable for projects demanding robust operation and environmental conformance.

This device is appropriate for engineers and system designers who need large programmable resources and dense I/O in a manufacturable surface-mount package, enabling consolidation of complex digital functions and simplified board-level integration.

Request a quote or submit a request for pricing and availability to begin integrating the XCVU190-2FLGB2104I into your design.