XCVU160-3FLGB2104E

The XCVU160-3FLGB2104E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) from AMD, supplied in a 2104-FCBGA package (47.5 × 47.5 mm). It provides a high-capacity programmable fabric with large embedded memory and a high I/O count for designs that require substantial on-chip logic and system connectivity.

With an operating voltage range of 970 mV to 1.03 V and an operating temperature range of 0 °C to 100 °C, this extended-grade device is intended for applications that leverage dense logic resources, significant on-chip RAM, and extensive I/O integration.

Key Features

• Core Logic  Approximately 2,026,500 logic elements to support large-scale programmable logic implementations and complex digital designs.
• Embedded Memory  Approximately 131 Mbits of on-chip RAM, suitable for designs requiring substantial local storage and buffering.
• I/O Capacity  Up to 702 user I/O pins to accommodate high-channel-count interfaces and dense system integration.
• Package & Mounting  2104-FCBGA package (47.5 × 47.5 mm), surface-mount mounted for compact, board-level integration.
• Power Supply  Core supply range of 0.970 V to 1.03 V compatible with modern low-voltage FPGA core environments.
• Grade & Temperature  Extended-grade device with an operating temperature range of 0 °C to 100 °C for standard production environments.
• Compliance  RoHS compliant.

Typical Applications

• High-density digital systems  Use the large logic capacity and embedded memory to implement complex, custom digital processing pipelines and state machines.
• Signal processing and buffering  Leverage approximately 131 Mbits of on-chip RAM for local data storage, buffering, and real-time signal processing tasks.
• High I/O-count interfaces  Employ up to 702 I/O pins for systems that require many parallel interfaces, sensor arrays, or multi-channel data acquisition.

Unique Advantages

• High integration density: Large logic element count and substantial on-chip RAM reduce the need for external logic and memory components.
• Extensive system connectivity: 702 I/O pins enable integration with numerous peripherals and parallel interfaces without extensive external multiplexing.
• Compact board footprint: 2104-FCBGA (47.5 × 47.5 mm) packaging allows dense placement of a high-capacity FPGA in production designs.
• Modern core voltage support: 0.970 V to 1.03 V supply compatibility aligns with contemporary low-voltage FPGA core designs.
• Production-ready grade: Extended grade and 0 °C to 100 °C operating range suit a wide range of commercial and industrial applications.
• RoHS compliant: Meets common environmental compliance requirements for electronic assemblies.

Why Choose XCVU160-3FLGB2104E?

The XCVU160-3FLGB2104E positions itself as a high-capacity Virtex® UltraScale™ FPGA option for designs that demand extensive programmable logic, significant embedded memory, and a high number of I/O. Its extended-grade specification, surface-mount 2104-FCBGA packaging, and RoHS compliance make it suitable for production environments that require a compact, integrated FPGA solution.

Designers building complex digital systems, high-channel-count interfaces, or memory-intensive processing blocks will find the device’s combination of approximately 2,026,500 logic elements, roughly 131 Mbits of on-chip RAM, and 702 I/O especially relevant for scalable, long-lived designs.

Request a quote or submit a quote request to obtain pricing and availability for the XCVU160-3FLGB2104E.