XCVU160-2FLGB2104I

The XCVU160-2FLGB2104I is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) in a 2104‑FCBGA package designed for industrial applications. It provides large on‑chip memory, extensive I/O, and substantial logic capacity for designs that require high integration and reliable operation across a wide temperature range.

Key Features

• Logic Capacity  Approximately 115,800 logic elements for implementing complex digital logic and custom compute pipelines.
• Embedded Memory  Approximately 131 Mbits of embedded memory (130,969,600 total RAM bits) to support buffering, large data structures, and on‑chip storage.
• High I/O Count  702 user I/O pins to support numerous parallel interfaces and complex connectivity requirements.
• Package & Mounting  2104‑FBGGA / 2104‑FCBGA package with supplier device package dimensions of 47.5 × 47.5 mm; surface mount for PCB integration.
• Power  Core supply range specified at 922 mV to 979 mV to match system-level power planning and regulator selection.
• Temperature & Grade  Industrial grade with an operating temperature range of −40 °C to 100 °C for deployment in harsh or temperature‑variable environments.
• Regulatory Compliance  RoHS compliant.

Typical Applications

• High‑density digital designs  Implement large FPGA fabrics and complex logic networks using the device’s ~115,800 logic elements.
• On‑chip buffering and data handling  Leverage approximately 131 Mbits of embedded memory for packet buffering, frame storage, and intermediate data processing.
• High‑I/O systems  Use the 702 I/O pins to aggregate multiple interfaces, sensors, or parallel data streams on a single device.
• Industrial control and automation  Industrial‑grade temperature range and robust packaging suited for factory floor and process control electronics.

Unique Advantages

• Substantial logic resources: Large logic element count enables implementation of complex state machines, accelerators, and custom processors on a single FPGA.
• Significant on‑chip memory: Approximately 131 Mbits of embedded RAM reduces the need for external memory for many buffering and storage tasks.
• Extensive connectivity: 702 I/O pins provide flexibility for multi‑lane interfaces and dense peripheral integration.
• Industrial temperature rating: Rated from −40 °C to 100 °C for reliable operation in temperature‑challenging environments.
• Space‑efficient package: 2104‑FCBGA (47.5 × 47.5 mm) surface‑mount package supports compact PCB layouts while delivering high resource density.
• RoHS compliant: Conforms to RoHS requirements for environmental and regulatory alignment.

Why Choose XCVU160-2FLGB2104I?

The XCVU160-2FLGB2104I combines a high logic element count, substantial embedded memory, and a large I/O complement in a single industrial‑grade FCBGA package. Its specified core voltage range and surface‑mount 2104‑FCBGA footprint make it suitable for system designs that require on‑chip capacity and robust environmental performance.

This device is positioned for engineering teams developing complex embedded systems that demand integration of logic, memory, and I/O while maintaining industrial temperature capability and RoHS compliance. It offers a scalable platform for consolidating functions and reducing external component count in production designs.

Request a quote or submit an inquiry to get pricing and availability for the XCVU160-2FLGB2104I. Our team can provide lead‑time information and support for your procurement and design planning.