XCVU13P-L2FLGA2577E

The XCVU13P-L2FLGA2577E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, packaged in a 2577-BBGA FCBGA. It delivers very large logic capacity and substantial on-chip memory for designs that require dense programmable logic, high I/O counts, and extended-temperature operation.

With hundreds of thousands of configurable logic blocks, hundreds of megabits of embedded RAM and a 448-pin I/O footprint, this device is intended for applications that need high integration and flexible reprogrammability within a surface-mount FCBGA package.

Key Features

• Logic Capacity — 3,780,000 logic elements and 216,000 CLBs provide extensive resources for complex digital designs and high-parallelism implementations.
• Embedded Memory — Approximately 515 Mbits of on-chip RAM (514,867,200 bits) to support large buffers, FIFOs and memory-intensive algorithms.
• I/O Density — 448 user I/O pins to support multi-channel interfaces and high-bandwidth connectivity.
• Package & Mounting — 2577-BBGA (2577-FCBGA, 52.5×52.5) surface-mount package suitable for compact board-level integration.
• Power — Core voltage supply range from 698 mV to 876 mV, enabling precise power domain planning for system designs.
• Temperature & Grade — Extended-grade device rated for operation from 0 °C to 110 °C, supporting deployments in thermally demanding environments.
• Compliance — RoHS compliant, meeting standard environmental material restrictions.

Typical Applications

• High-capacity logic and memory designs — For systems that need large programmable fabric and significant on-chip RAM for buffering and algorithmic processing.
• High-density I/O interfaces — Suitable for bridging and aggregating multiple high-speed links or sensor channels using the 448 I/O pins.
• Board-level integration requiring compact packaging — The 2577-FCBGA package supports high integration on densely populated PCBs.
• Extended-temperature deployments — Use in applications that operate across 0 °C to 110 °C and require extended-grade components.

Unique Advantages

• Massive programmable fabric: 3,780,000 logic elements enable complex system implementations and high parallelism without external ASICs.
• Large embedded memory: Approximately 515 Mbits of on-chip RAM reduce external memory dependence and simplify data-path design.
• High I/O count: 448 I/O pins provide flexibility for multi-channel interfacing and parallel connectivity.
• Compact FCBGA package: The 2577-FCBGA (52.5×52.5) package supports high-density board designs while maintaining surface-mount assembly compatibility.
• Extended operating range: Rated 0 °C to 110 °C and marked as Extended grade for applications with elevated thermal demands.
• Regulatory compliance: RoHS compliant to meet common environmental material requirements.

Why Choose XCVU13P-L2FLGA2577E?

The XCVU13P-L2FLGA2577E combines very large logic capacity, substantial embedded memory and a high I/O count in a single FCBGA surface-mount package, making it suitable for system designs that require high integration and flexible reprogrammability. Its extended temperature rating and RoHS compliance further align it with designs that need dependable operation across broader thermal conditions.

This device is well suited for engineers and teams building complex, memory- and I/O-intensive FPGA-based systems who need a high-density component backed by the Virtex UltraScale+ family architecture and supporting documentation.

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