XCVU13P-L2FIGD2104E

The XCVU13P-L2FIGD2104E is a Virtex® UltraScale+™ field programmable gate array (FPGA) IC by AMD, offered in a 2104-FCBGA package. It provides a high-capacity, programmable logic platform with a large number of logic elements, substantial on-chip memory, and a high I/O count for complex digital designs.

Designed for extended-grade operation, this surface-mount FPGA combines dense logic, abundant embedded memory, and broad I/O connectivity while operating within a low-voltage core range and an extended temperature window.

Key Features

• High Logic Capacity — 3,780,000 logic elements to implement large-scale digital designs and complex custom logic functions.
• Embedded Memory — Approximately 515 Mbits of embedded memory for on-chip buffering, frame storage, and data processing.
• Extensive I/O — 676 I/O to support wide external interfacing and multiple parallel buses or high-density connectivity.
• Low-Voltage Core — Core supply range of 698 mV to 876 mV to match system power-rail requirements for this device.
• Package & Mounting — 2104-FCBGA (52.5 × 52.5 mm) package in a surface-mount BGA format for high-density board integration.
• Extended Temperature Grade — Rated for operation from 0 °C to 110 °C and designated as Extended grade for broader thermal use cases.
• Standards Compliance — RoHS compliant to meet environmental and material regulations.

Unique Advantages

• High integration density: 3.78 million logic elements enable consolidation of multiple functions into a single FPGA, reducing external component count.
• Large on-chip memory: Approximately 515 Mbits of embedded memory provide ample local storage for buffering, packet processing, or data-intensive algorithms.
• Broad external connectivity: 676 I/O pins allow flexible interfacing to high-speed buses, sensors, and parallel peripherals without additional multiplexing hardware.
• Compact, manufacturable package: The 2104-FCBGA (52.5 × 52.5 mm) surface-mount package supports high-density PCB layouts and automated assembly processes.
• Extended thermal capability: Rated 0 °C to 110 °C and Extended grade for deployments that require operation across a wider temperature range than standard commercial parts.
• Low-voltage core compatibility: Core voltage specification of 698 mV to 876 mV aligns with modern low-voltage power architectures.

Why Choose XCVU13P-L2FIGD2104E?

The XCVU13P-L2FIGD2104E positions itself as a high-capacity, highly integrated FPGA option offering a combination of extensive logic resources, substantial embedded memory, and a large I/O complement—all in a single 2104-FCBGA surface-mount package. Its extended temperature rating and RoHS compliance add practical deployment flexibility and environmental conformity.

This device is suited to designs that require dense programmable logic, large on-chip storage, and broad external interfacing while operating within a low-voltage core domain. Backed by AMD as the manufacturer, it delivers a scalable hardware resource for complex, space-constrained board-level implementations.

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