XCVU13P-L2FHGA2104E

The XCVU13P-L2FHGA2104E is a Virtex® UltraScale+™ FPGA IC offering very large logic capacity and dense I/O in a 2104-ball FCBGA package. With millions of logic elements, hundreds of megabits of embedded memory and an extended temperature grade, it is suited for designs that require substantial on-chip resources and high pin counts.

Key Features

• Logic Capacity  Provides 3,780,000 logic elements to implement large-scale, complex digital designs.
• On‑Chip Memory  Includes approximately 515 Mbits of embedded memory for large buffering, state storage and algorithm acceleration.
• High-Density I/O  Up to 832 I/O pins for broad external connectivity and complex interface support.
• Package and Mounting  Delivered in a 2104-BBGA / 2104-FCBGA surface-mount package (52.5 × 52.5 mm) for high pin-count, compact board integration.
• Power Supply Range  Operates from 698 mV to 876 mV, enabling low-voltage FPGA core operation consistent with modern power architectures.
• Temperature and Grade  Extended grade device rated for operation from 0 °C to 110 °C, supporting higher-temperature applications.
• Environmental Compliance  RoHS compliant to meet common regulatory requirements for lead-free assembly.

Typical Applications

• High-density signal processing  Leverage millions of logic elements and hundreds of Mbits of embedded memory to implement large DSP chains and buffering on a single device.
• Network and communications infrastructure  Use the device’s 832 I/O pins and large logic fabric for multi-protocol interface aggregation and complex packet processing.
• Compute acceleration and custom processors  Deploy extensive custom logic and memory resources to accelerate algorithms and offload tasks from host processors.

Unique Advantages

• Highly integrated resource set: 3,780,000 logic elements and approximately 515 Mbits of embedded memory reduce the need for external components and simplify system architecture.
• Dense external connectivity: 832 I/O pins provide flexible interfacing options for multi-channel designs and high-throughput systems.
• Compact, high-pin-count package: 2104-FCBGA (52.5 × 52.5 mm) delivers a small PCB footprint for a very high I/O and resource density.
• Low-voltage core operation: 698 mV to 876 mV supply range supports modern low-voltage power domains for efficient system power design.
• Extended temperature rating: 0 °C to 110 °C operational range supports deployment in thermally demanding environments.
• Regulatory compliance: RoHS compliance enables use in lead-free manufacturing processes.

Why Choose XCVU13P-L2FHGA2104E?

The XCVU13P-L2FHGA2104E positions itself for designs that require very large programmable logic, substantial embedded memory, and a high number of I/O signals in a single FPGA. Its combination of 3.78 million logic elements, approximately 515 Mbits of on-chip RAM, and 832 I/O pins provides scalability for complex implementations while reducing dependence on external components.

With a 2104-FCBGA surface-mount package, low-voltage core operation and an extended 0 °C to 110 °C rating, this device addresses compact, high-density designs that must operate in challenging thermal environments. Choose this FPGA when your design priorities are high resource density, flexible I/O, and on-chip memory capacity.

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