XCVU13P-3FHGC2104E

The XCVU13P-3FHGC2104E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC that delivers high logic density and large on-chip memory in a 2104-FCBGA package. Its architecture is represented by a substantial logic element count and a significant embedded RAM budget, supporting complex digital designs that require extensive programmable resources.

Key measurable attributes include approximately 3,780,000 logic elements, roughly 515 Mbits of embedded memory, and 416 I/O pins, all in a 2104-FCBGA (52.5 × 52.5 mm) surface-mount package with an extended-grade operating temperature range.

Key Features

• Logic Capacity  Approximately 3,780,000 logic elements and 216,000 logic blocks provide substantial programmable fabric for complex logic implementation.
• Embedded Memory  Approximately 514,867,200 bits (≈515 Mbits) of on-chip RAM to support large buffers, FIFOs, and memory-intensive logic functions.
• I/O and Packaging  416 I/O pins in a 2104-FCBGA supplier device package (52.5 × 52.5 mm) provide extensive external connectivity in a compact FCBGA form factor.
• Power Supply  Supported supply range from 873 mV to 927 mV allows defined core voltage planning for power domain design.
• Thermal and Grade  Extended grade device with an operating temperature range of 0 °C to 100 °C, suitable for designs within that environmental envelope.
• Mounting and Compliance  Surface-mount package with RoHS compliance for modern assembly and regulatory requirements.

Unique Advantages

• High logic density: The large count of logic elements enables implementation of complex, high-capacity digital designs without splitting functions across multiple devices.
• Substantial on-chip memory: Approximately 515 Mbits of embedded RAM reduces reliance on external memory for buffering and accelerates data-path operations.
• Extensive I/O availability: 416 I/O pins provide ample external interfacing options for multi-channel designs and peripheral integration.
• Robust packaging: 2104-FCBGA (52.5 × 52.5 mm) offers a high-pin-count, surface-mount solution that consolidates I/O and logic density in a single device.
• Defined power envelope: A core supply window of 873 mV–927 mV supports precise power budgeting and power-supply design.
• Extended operating range: Rated for 0 °C–100 °C operation and designated as Extended grade, enabling deployment where that thermal range matches system requirements.

Why Choose XCVU13P-3FHGC2104E?

The XCVU13P-3FHGC2104E positions itself as a high-capacity Virtex® UltraScale+™ FPGA offering a combination of millions of logic elements, hundreds of megabits of embedded memory, and hundreds of I/O pins in a single FCBGA package. These measured capabilities support integration of complex logic, large on-chip data storage, and extensive external interfacing within a single device footprint.

This device is suited for designs that require significant programmable resources and a clearly defined power and thermal profile. Its extended-grade rating and RoHS compliance add practical benefits for production and environmental adherence, while the supplier package details aid mechanical and PCB planning.

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