XCVU13P-3FSGA2577E

The XCVU13P-3FSGA2577E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) manufactured by AMD. It is delivered in a 2577-FCBGA package (52.5 × 52.5 mm) with surface-mount mounting and extended grade specification.

With 3,780,000 logic elements, approximately 99 Mbits of embedded memory, and 448 I/Os, this device targets designs that require large on-chip logic and memory capacity combined with a high I/O count. The device operates across a defined core voltage range of 873 mV to 927 mV and an operating temperature range of 0°C to 100°C.

Key Features

• Architecture & Logic  Virtex UltraScale+ FPGA architecture implemented with 3,780,000 logic elements for substantial programmable logic capacity.
• Embedded Memory  Approximately 99 Mbits of on-chip RAM bits to support large buffering, state storage, and algorithmic workloads.
• I/O Density  448 general-purpose I/Os to support wide parallel interfaces and high channel counts.
• Power  Specified core voltage supply range from 873 mV to 927 mV to match system power-rail planning.
• Package & Mounting  2577-BBGA / 2577-FCBGA package (52.5 × 52.5 mm), surface-mount format suitable for compact system boards.
• Temperature & Grade  Extended-grade device rated for 0°C to 100°C ambient operating temperature.
• Compliance  RoHS compliant.

Typical Applications

• High-density signal processing  Implements complex, large-scale processing algorithms using the device’s 3,780,000 logic elements and substantial embedded memory.
• High-throughput I/O systems  Supports systems requiring many parallel interfaces or channelized I/O with 448 available I/O pins.
• System integration and prototyping  Surface-mount 2577-FCBGA packaging and extensive logic/memory resources make the device suitable for integrating multiple subsystems onto a single FPGA platform.

Unique Advantages

• High logic capacity: 3,780,000 logic elements enable implementation of large designs without immediate external logic partitioning.
• Large embedded memory: Approximately 99 Mbits of on-chip RAM bits reduce external memory dependency for buffering and stateful processing.
• Extensive I/O: 448 I/O pins provide flexibility for interfacing to wide buses, parallel sensors, or numerous peripherals.
• Defined power window: Core voltage range of 873 mV to 927 mV allows precise power-rail planning and delivery.
• Compact, carrier-ready package: 2577-FCBGA (52.5 × 52.5 mm) surface-mount package supports dense board-level integration.
• Extended-grade operation: Rated for 0°C to 100°C operation to meet a range of environment requirements.

Why Choose XCVU13P-3FSGA2577E?

The XCVU13P-3FSGA2577E combines a high logic element count, substantial on-chip memory, and a large I/O complement in a single Virtex UltraScale+ FPGA package from AMD. This combination provides designers with a highly integrated platform for implementing complex, memory-intensive, and I/O-rich designs.

It is well suited to system designers and procurement teams seeking a scalable FPGA resource for advanced designs that require significant on-chip resources and a stable operating envelope. The device’s package, voltage specification, extended-grade temperature range, and RoHS compliance make it a practical choice for a variety of demanding board-level implementations.

Request a quote or submit your pricing inquiry for the XCVU13P-3FSGA2577E to receive availability and lead-time information tailored to your project needs.