XCVU13P-3FLGA2577E

The XCVU13P-3FLGA2577E is a Virtex® UltraScale+™ Field Programmable Gate Array (FPGA) IC from AMD, delivered in a 2577‑ball FCBGA package. It provides a large logic fabric and significant on-chip memory, packaged for surface-mount integration and engineered for extended-grade operation.

With millions of logic elements and hundreds of megabits of embedded memory, this device is suited for designs that require high logic capacity, substantial embedded RAM, and wide I/O support while operating within a nominal core voltage range of 0.873–0.927 V.

Key Features

• Core Logic Capacity — 3,780,000 logic elements for implementing large, complex digital designs and custom processing pipelines.
• Embedded Memory — Approximately 515 Mbits of on-chip RAM to support data buffering, look-up tables, and large state machines without external memory.
• I/O Resources — 448 available I/O pins to enable broad connectivity and parallel interfacing with external peripherals and subsystems.
• Power Supply — Operates with a supply range of 873 mV to 927 mV, enabling integration into systems designed around this core-voltage window.
• Package and Mounting — 2577‑FCBGA package (52.5 × 52.5 mm) in a surface-mount form factor for high-density board-level implementation.
• Thermal and Grade — Extended grade with an operating temperature range of 0 °C to 100 °C for applications requiring broader-than-commercial tolerance.
• Regulatory Compliance — RoHS compliant for lead-free assembly and regulatory alignment.

Typical Applications

• High‑density logic implementations — Use the large logic capacity to integrate complex custom accelerators, signal processing blocks, or control logic into a single device.
• Memory‑intensive designs — Leverage approximately 515 Mbits of embedded memory for buffering, packet processing, or large lookup structures without relying solely on external RAM.
• Parallel I/O systems — Employ 448 I/O pins to connect multiple high-bandwidth interfaces or to implement wide parallel buses and sensor arrays.

Unique Advantages

• High logic density: 3.78 million logic elements reduce the need for multiple devices, simplifying board design and lowering BOM complexity.
• Substantial on‑chip RAM: Approximately 515 Mbits of embedded memory enables large in-device buffering and state storage, improving throughput and latency for on-chip processing.
• Broad I/O count: 448 I/O pins provide flexibility for interfacing with numerous peripherals or implementing wide parallel data paths.
• Surface‑mount FCBGA package: 2577‑ball FCBGA (52.5 × 52.5 mm) supports high-density PCB routing while maintaining a standardized footprint for assembly.
• Extended operating range: Rated for 0 °C to 100 °C, suitable for systems that require wider-than-standard commercial temperature tolerance.
• RoHS compliant: Supports lead‑free manufacturing flows and regulatory requirements for many markets.

Why Choose XCVU13P-3FLGA2577E?

The XCVU13P-3FLGA2577E combines very large logic capacity with significant embedded memory and a high I/O count in a single surface-mount FCBGA package. This combination makes it appropriate for designs that consolidate complex logic, substantial buffering, and extensive interfacing into one device while operating within a defined core voltage range and extended temperature envelope.

It is well suited to engineering teams seeking a scalable, high‑capacity FPGA platform that simplifies system architecture by reducing component count and supporting robust on-chip resources, helping to streamline board design and integration.

Request a quote or submit your specifications to receive pricing and availability for the XCVU13P-3FLGA2577E.