XCVU13P-L2FSGA2577E

The XCVU13P-L2FSGA2577E is a Virtex® UltraScale+™ Field Programmable Gate Array from AMD, provided in a 2577-FCBGA (52.5 × 52.5 mm) package. It combines a very large logic capacity with substantial on-chip memory and a high I/O count, making it suitable for designs that require dense programmable logic and significant embedded RAM.

Key measurable attributes include 3,780,000 logic elements, approximately 99 Mbits of embedded memory, 448 I/O, an extended-grade operating temperature range of 0 °C to 100 °C, and a supply voltage range of 698 mV to 742 mV—features that support complex, high-density FPGA implementations.

Key Features

• Logic Capacity  3,780,000 logic elements and 216,000 configurable logic blocks (CLBs) to support dense programmable logic implementations.
• Embedded Memory  Approximately 99 Mbits of on-chip RAM (99,090,432 total RAM bits) for buffering, data storage, and local algorithm state.
• I/O Resources  448 I/O pins to accommodate broad interfacing requirements and multiple high-density connections.
• Package  2577-BBGA / 2577-FCBGA package format (52.5 × 52.5 mm) for high-pin-count, board-level integration. Surface-mount mounting type.
• Power Supply Range  Operates from a supply voltage of 698 mV to 742 mV, allowing designers to plan power delivery precisely to the device.
• Temperature & Grade  Extended-grade part with an operating temperature range of 0 °C to 100 °C, suitable for many commercial and enterprise deployments.
• Compliance  RoHS-compliant for adherence to environmental restrictions on hazardous substances.

Typical Applications

• High-density FPGA designs  Applications that require large logic counts and abundant embedded memory can leverage the 3,780,000 logic elements and ~99 Mbits of RAM.
• Communications and networking  Use cases that need many I/O and extensive parallel logic, supported by 448 I/O pins and the device's large logic fabric.
• Data processing and acceleration  Workloads requiring on-chip memory and high logic density for buffering, preprocessing, or algorithm acceleration.
• Board-level integration  Designs requiring a high-pin-count FCBGA package for compact, surface-mount integration on complex PCBs.

Unique Advantages

• High logic density: 3,780,000 logic elements enable implementation of large, complex designs on a single device.
• Substantial on-chip memory: Approximately 99 Mbits of embedded RAM reduces dependence on external memory for many buffering and state-storage needs.
• Extensive I/O connectivity: 448 I/O pins support multiple interfaces and high parallelism at the board level.
• Robust packaging for high pin count: 2577-FCBGA (52.5 × 52.5 mm) package provides the pin density required for complex system integration while supporting surface-mount assembly.
• Controlled power envelope: A defined supply voltage range (698 mV–742 mV) allows precise power budgeting and design of supply rails.
• Extended operating range: Rated for 0 °C to 100 °C operation, suitable for many commercial and enterprise environments.

Why Choose XCVU13P-L2FSGA2577E?

The XCVU13P-L2FSGA2577E positions itself as a high-capacity Virtex® UltraScale+™ FPGA option offering a combination of very large logic resources, substantial embedded memory, and extensive I/O in a high-density FCBGA package. These measurable capabilities make it a fit for engineers and teams implementing complex, resource-intensive FPGA designs that require significant on-chip resources and board-level connectivity.

With RoHS compliance and an extended-grade temperature range, this device provides predictable electrical and environmental parameters for long-term projects. Its specification set supports scalable designs where logic density, memory footprint, and I/O count are primary selection criteria.

Request a quote or submit a sales inquiry to learn about availability, pricing, and lead time for the XCVU13P-L2FSGA2577E. Our team can provide the detailed procurement information you need to move your design forward.