XCVU160-2FLGC2104I

The XCVU160-2FLGC2104I is a Virtex® UltraScale™ field programmable gate array (FPGA) IC optimized for designs that require very high logic and memory resources. It provides 2,026,500 logic elements and approximately 131 Mbits of embedded memory to support complex, large-scale digital functions.

Built for industrial use, the device offers 416 I/Os, a 2104‑FCBGA package (47.5×47.5 mm), surface-mount assembly, an operating temperature range of -40 °C to 100 °C, and a supply voltage range of 922 mV to 979 mV, making it suitable for robust, high‑integration system designs.

Key Features

• Core Logic  2,026,500 logic elements provide the capacity for large-scale digital designs and complex custom hardware implementations.
• Embedded Memory  Approximately 131 Mbits of on-chip RAM to support data buffering, large lookup tables, and state storage without external memory dependence.
• I/O Integration  416 general-purpose I/Os enable extensive peripheral interfacing and multi-channel signal routing within a single device.
• Package and Mounting  2104‑FBG A (FCBGA) package, 47.5×47.5 mm, designed for surface-mount board assembly to support dense board layouts.
• Power  Narrow core supply window from 922 mV to 979 mV for defined power domain design and supply planning.
• Temperature Range  Industrial-grade operating range of -40 °C to 100 °C for deployment in demanding environmental conditions.
• Compliance  RoHS compliant for environmental and regulatory alignment in manufacturing and deployment.

Typical Applications

• Complex digital signal processing  Leverage the high logic count and large on-chip memory for FPGA-based acceleration of compute‑intensive signal processing pipelines.
• High-density protocol bridging and interface aggregation  Use the 416 I/Os to implement multi-channel protocol converters, aggregators, and custom interface logic.
• System prototyping and validation  Deploy the device as a platform for validating large SoC subsystems, leveraging its logic and memory capacity for complete system emulation.
• Industrial control and automation  Industrial temperature rating and robust packaging suit control systems that demand long-term operation in challenging environments.

Unique Advantages

• High integration density: 2,026,500 logic elements and ~131 Mbits of embedded memory reduce the need for external logic and memory ICs, simplifying BOM and board complexity.
• Extensive I/O capability: 416 I/Os support complex interfacing and multi‑channel designs without additional I/O expanders.
• Industrial temperature tolerance: Rated from -40 °C to 100 °C for reliable operation in temperature‑sensitive deployments.
• Compact FCBGA package: 2104‑FCBGA (47.5×47.5 mm) provides a compact footprint for high-density board designs while supporting surface-mount assembly.
• Defined supply window: Core voltage specification of 922 mV to 979 mV simplifies power-supply design and margining for system integrators.
• RoHS compliant: Aligned with environmental manufacturing requirements for widespread deployment.

Why Choose XCVU160-2FLGC2104I?

The XCVU160-2FLGC2104I positions itself as a high-capacity, industrial-grade FPGA option for engineers building large-scale, integration-heavy systems. Its combination of over two million logic elements, approximately 131 Mbits of embedded memory, and 416 I/Os makes it suitable for designs that consolidate multiple functions into a single programmable device.

For teams focused on scalable hardware platforms, the device offers a balance of integration, robust thermal range, and a compact FCBGA package that supports dense board implementations and long-term deployment in industrial environments.

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