XCVU160-H1FLGB2104E

The XCVU160-H1FLGB2104E is a Virtex® UltraScale™ Field Programmable Gate Array (FPGA) IC designed for high-capacity programmable logic applications. Built around UltraScale™ architecture, the device provides extensive logic resources, embedded memory and a high I/O count for designs that require large on-chip integration.

With 2,026,500 logic elements, approximately 131 Mbits of embedded memory and 702 I/Os in a 2104-FCBGA (47.5×47.5 mm) package, this part addresses designs that need significant compute resources, on-chip buffering and broad external connectivity while operating within an extended-grade temperature range.

Key Features

• Core Logic  Provides 115,800 CLBs and 2,026,500 logic elements to support large, complex digital designs.
• Embedded Memory  Approximately 131 Mbits of on-chip RAM for high-capacity buffering, look-up tables and data storage inside the FPGA fabric.
• I/O Capacity  702 I/Os to support extensive peripheral connectivity and multi-channel interfaces from a single device.
• Package  2104-FCBGA package (47.5×47.5 mm) offering a high pin-count, surface-mount form factor for dense board-level integration.
• Power  Core supply range from 0.922 V to 1.03 V to match system power-rail requirements and design power planning.
• Temperature Grade  Extended-grade operation from 0 °C to 100 °C for deployment in extended-temperature environments.
• Mounting & Compliance  Surface mount device; RoHS compliant for modern manufacturing requirements.

Typical Applications

• High-density compute designs  Large logic and memory capacity enable implementation of complex compute kernels and custom accelerators on-chip.
• Network and communications  High I/O count and on-chip memory support multi-channel interfaces, packet buffering and protocol processing.
• Signal processing and video  Extensive logic resources and embedded RAM help implement real-time processing pipelines and frame buffering.

Unique Advantages

• High logic capacity: 2,026,500 logic elements and 115,800 CLBs give designers room to integrate large, feature-rich designs into a single device.
• Substantial on-chip memory: Approximately 131 Mbits of embedded RAM reduces dependence on external memory for buffering and data staging.
• Broad I/O availability: 702 I/Os allow consolidation of multiple interfaces and peripherals without significant external multiplexing.
• Compact, high-pin package: 2104-FCBGA (47.5×47.5 mm) provides a dense routing footprint for high-pin-count system implementations.
• Extended operating range: 0 °C to 100 °C temperature rating supports deployment in environments requiring extended-temperature operation.
• Manufacturing-ready: Surface-mount package and RoHS compliance align with modern assembly and environmental requirements.

Why Choose XCVU160-H1FLGB2104E?

The XCVU160-H1FLGB2104E positions itself as a high-capacity, highly integrated FPGA option for projects that demand extensive logic, on-chip memory and numerous I/Os. Its combination of 2,026,500 logic elements, approximately 131 Mbits of embedded RAM and 702 I/Os in a 2104-FCBGA package supports consolidation of complex functions and high channel counts into a single programmable device.

This part is well suited to design teams and systems that require scalability and integration at the board level, offering a balance of logic density, embedded memory and connectivity while meeting extended-grade temperature and RoHS requirements.

Request a quote or submit a product inquiry to receive pricing and availability information for the XCVU160-H1FLGB2104E. Our team will respond with the details you need to move your design forward.